型号
- 型号
- 关键词
| 型号 | HM9-6504-9 | HM1-6504B-9+ | 5962-01-220-5292 | HM4-6504-8 | HM4-6504B-8 | HM4-6504B-9 | HM4-6504-2 | HM3-6504-5 | 5962-01-325-4823 |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | HM9-6504-9 | IC,SRAM,4KX1,CMOS,DIP,18PIN,CERAMIC | IC,SRAM,4KX1,CMOS,DIP,18PIN,CERAMIC | IC,SRAM,4KX1,CMOS,LLCC,18PIN,CERAMIC | IC,SRAM,4KX1,CMOS,LLCC,18PIN,CERAMIC | IC,SRAM,4KX1,CMOS,LLCC,18PIN,CERAMIC | HM4-6504-2 | HM3-6504-5 | IC,SRAM,4KX1,CMOS,LLCC,18PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 最长访问时间 | 320 ns | 220 ns | 320 ns | 320 ns | 220 ns | 220 ns | 320 ns | 370 ns | 320 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-XDFP-F18 | R-XDIP-T18 | R-XDIP-T18 | R-XQCC-N18 | R-XQCC-N18 | R-XQCC-N18 | R-XQCC-N18 | R-PDIP-T18 | R-XQCC-N18 |
| 内存密度 | 4096 bi | 4096 bi | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | - | -55 °C |
| 组织 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DFP | DIP | DIP | QCCN | QCCN | QCCN | QCCN | DIP | QCCN |
| 封装等效代码 | FL18,.3 | DIP18,.3 | DIP18,.3 | LCC18,.3X.35 | LCC18,.3X.35 | LCC18,.3X.35 | LCC18,.3X.35 | DIP18,.3 | LCC18,.3X.35 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大待机电流 | 0.000015 A | 0.000015 A | 0.000025 A | 0.000025 A | 0.000025 A | 0.000015 A | 0.000025 A | 0.0002 A | 0.000025 A |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL | QUAD |
| 厂商名称 | Renesas(瑞萨电子) | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - | 2 V |
| 最大压摆率 | 0.014 mA | 0.019 mA | 0.014 mA | 0.014 mA | 0.019 mA | 0.019 mA | 0.014 mA | - | 0.014 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 包装说明 | - | - | DIP, DIP18,.3 | QCCN, LCC18,.3X.35 | QCCN, LCC18,.3X.35 | QCCN, LCC18,.3X.35 | QCCN, LCC18,.3X.35 | DIP, DIP18,.3 | QCCN, LCC18,.3X.35 |