型号
- 型号
- 关键词
Standard SRAM, 32KX8, 17ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
厂商名称：SK Hynix(海力士)
厂商官网：http://www.hynix.com/eng/
下载文档| 型号 | HY638256P-17 | HY638256LP-17 | HY638256LR1-17 | HY638256LT1-17 | HY638256J-17 | HY638256LJ-17 | HY638256R1-17 | HY638256T1-17 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 32KX8, 17ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 17ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 17ns, CMOS, PDSO28, 8 X 13.40 MM, REVERSE, TSOP1-28 | Standard SRAM, 32KX8, 17ns, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28 | Standard SRAM, 32KX8, 17ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 32KX8, 17ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 32KX8, 17ns, CMOS, PDSO28, 8 X 13.40 MM, REVERSE, TSOP1-28 | Standard SRAM, 32KX8, 17ns, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28 |
| 厂商名称 | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) |
| 零件包装代码 | DIP | DIP | TSOP | TSOP | SOJ | SOJ | TSOP | TSOP |
| 包装说明 | DIP, DIP28,.3 | DIP, DIP28,.3 | TSOP1-R, TSSOP28,.53,22 | TSOP1, TSSOP28,.53,22 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | TSOP1-R, | TSOP1, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 17 ns | 17 ns | 17 ns | 17 ns | 17 ns | 17 ns | 17 ns | 17 ns |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e6 | e6 |
| 长度 | 36.576 mm | 36.576 mm | 11.8 mm | 11.8 mm | 17.89 mm | 17.89 mm | 11.8 mm | 11.8 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | TSOP1-R | TSOP1 | SOJ | SOJ | TSOP1-R | TSOP1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.318 mm | 4.318 mm | 1.2 mm | 1.2 mm | 3.56 mm | 3.56 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN BISMUTH | TIN BISMUTH |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | J BEND | J BEND | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 0.55 mm | 0.55 mm | 1.27 mm | 1.27 mm | 0.55 mm | 0.55 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 8 mm | 8 mm | 6.8 mm | 6.8 mm | 8 mm | 8 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - | - |
| 封装等效代码 | DIP28,.3 | DIP28,.3 | TSSOP28,.53,22 | TSSOP28,.53,22 | SOJ28,.34 | SOJ28,.34 | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 最大待机电流 | 0.002 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.002 A | 0.00005 A | - | - |
| 最小待机电流 | 4.5 V | 2 V | 2 V | 2 V | 4.5 V | 2 V | - | - |
| 最大压摆率 | 0.15 mA | 0.15 mA | 0.1 mA | 0.1 mA | 0.15 mA | 0.15 mA | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |