Video Switch ICs
器件类别:半导体 其他集成电路(IC)
厂商名称:Maxim(美信半导体)
厂商官网:https://www.maximintegrated.com/en.html
下载文档型号 | IH5341CPD- | IH5352IWE | IH5341ITW | IH5341CJD | IH5352MJE-883B | IH5341CWE-T | IH5352MJE | IH5341MTW-883B | IH5352CPE |
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描述 | Video Switch ICs | Video Switch ICs Quad SPST Normally Open RF/Video Switch | Video Switch ICs Dual SPST Normally Open RF/Video Switch | Video Switch ICs Dual SPST Normally Open RF/Video Switch | Video Switch ICs Dual/Quad RF/Video Switches | Video Switch ICs | Video Switch ICs Dual/Quad RF/Video Switches | Video Switch ICs | Video Switch ICs Dual/Quad RF/Video Switches |
是否无铅 | - | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | - | 含铅 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | - | 不符合 |
厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | - | not_compliant | not_compliant | - | not_compliant |
JESD-30 代码 | - | R-PDSO-G16 | O-MBCY-W10 | R-GDIP-T14 | - | R-PDSO-G16 | R-GDIP-T16 | - | R-PDIP-T16 |
JESD-609代码 | - | e0 | e0 | e0 | - | e0 | e0 | - | e0 |
正常位置 | - | NO | NO | NO | - | NO | NO | - | NO |
功能数量 | - | 4 | 2 | 2 | - | 2 | 4 | - | 4 |
端子数量 | - | 16 | 10 | 14 | - | 16 | 16 | - | 16 |
最大通态电阻 (Ron) | - | 350 Ω | 350 Ω | 350 Ω | - | 300 Ω | 250 Ω | - | 350 Ω |
最高工作温度 | - | 85 °C | 85 °C | 85 °C | - | 70 °C | 125 °C | - | 70 °C |
输出 | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT |
封装主体材料 | - | PLASTIC/EPOXY | METAL | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY |
封装代码 | - | SOP | TO-100 | DIP | - | SOP | DIP | - | DIP |
封装等效代码 | - | SOP16,.4 | CAN10,.23 | DIP14,.3 | - | SOP16,.4 | DIP16,.3 | - | DIP16,.3 |
封装形状 | - | RECTANGULAR | ROUND | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | CYLINDRICAL | IN-LINE | - | SMALL OUTLINE | IN-LINE | - | IN-LINE |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | 240 | 240 | - | 245 | 240 | - | 240 |
电源 | - | 5,+-15 V | 5,+-15 V | 5,+-15 V | - | 5,+-15 V | 5,+-15 V | - | 5,+-15 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
表面贴装 | - | YES | NO | NO | - | YES | NO | - | NO |
最长接通时间 | - | 300 ns | 300 ns | 300 ns | - | 300 ns | 300 ns | - | 300 ns |
切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
技术 | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | - | CMOS |
温度等级 | - | OTHER | OTHER | OTHER | - | COMMERCIAL | MILITARY | - | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) |
端子形式 | - | GULL WING | WIRE | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE |
端子节距 | - | 1.27 mm | - | 2.54 mm | - | 1.27 mm | 2.54 mm | - | 2.54 mm |
端子位置 | - | DUAL | BOTTOM | DUAL | - | DUAL | DUAL | - | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | 20 | 20 | - | NOT SPECIFIED | 20 | - | 20 |
零件包装代码 | - | - | SMT | DIP | - | SOIC | DIP | - | DIP |
包装说明 | - | - | METAL CAN, TO-100, 10 PIN | CERDIP-14 | - | SOIC-16 | DIP, DIP16,.3 | - | DIP, DIP16,.3 |
针数 | - | - | 10 | 14 | - | 16 | 16 | - | 16 |
模拟集成电路 - 其他类型 | - | - | SPST | SPST | - | SPST | SPST | - | SPST |
湿度敏感等级 | - | - | 1 | 1 | - | 1 | 1 | - | 1 |
负电源电压最大值(Vsup) | - | - | -15 V | -15 V | - | -15 V | -15 V | - | -15 V |
负电源电压最小值(Vsup) | - | - | -5 V | -5 V | - | -5 V | -5 V | - | -5 V |
标称负供电电压 (Vsup) | - | - | -15 V | -15 V | - | -15 V | -15 V | - | -15 V |
信道数量 | - | - | 1 | 1 | - | 1 | 1 | - | 1 |
标称断态隔离度 | - | - | 80 dB | 80 dB | - | 80 dB | 80 dB | - | 80 dB |
通态电阻匹配规范 | - | - | 5 Ω | 5 Ω | - | 5 Ω | 5 Ω | - | 5 Ω |
最大供电电压 (Vsup) | - | - | 15 V | 15 V | - | 15 V | 15 V | - | 15 V |
最小供电电压 (Vsup) | - | - | 5 V | 5 V | - | 5 V | 5 V | - | 5 V |
标称供电电压 (Vsup) | - | - | 15 V | 15 V | - | 15 V | 15 V | - | 15 V |
最长断开时间 | - | - | 150 ns | 150 ns | - | 150 ns | 150 ns | - | 150 ns |