IS62LV12816ALL-55TI,IS62LV12816ALL-55TI pdf中文资料,IS62LV12816ALL-55TI引脚图,IS62LV12816ALL-55TI电路-Datasheet-电子工程世界

参数对比

与IS62LV12816ALL-55TI相近的元器件有：IS62LV12816ALL-10BI、IS62LV12816ALL-10B、IS62LV12816ALL-10TI、IS62LV12816ALL-70T、IS62LV12816ALL-70TI、IS62LV12816ALL-10T、IS62LV12816ALL-55T、IS62LV12816ALL-70B、IS62LV12816ALL-70BI。描述及对比如下：

型号	IS62LV12816ALL-55TI	IS62LV12816ALL-10BI	IS62LV12816ALL-10B	IS62LV12816ALL-10TI	IS62LV12816ALL-70T	IS62LV12816ALL-70TI	IS62LV12816ALL-10T	IS62LV12816ALL-55T	IS62LV12816ALL-70B	IS62LV12816ALL-70BI
描述	Standard SRAM, 128KX16, 55ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48	Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 55ns, CMOS, PDSO44, TSOP2-44	Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48	Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	TSOP2	BGA	BGA	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	BGA	BGA
包装说明	TSOP2-44	6 X 8 MM, MINI, BGA-48	6 X 8 MM, MINI, BGA-48	TSOP2-44	TSOP2-44	TSOP2-44	TSOP2-44	TSOP2-44	6 X 8 MM, MINI, BGA-48	6 X 8 MM, MINI, BGA-48
针数	44	48	48	44	44	44	44	44	48	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli	compli	compli
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	55 ns	100 ns	100 ns	100 ns	70 ns	70 ns	100 ns	55 ns	70 ns	70 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PDSO-G44	R-PBGA-B48	R-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PBGA-B48	R-PBGA-B48
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	18.41 mm	8 mm	8 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	8 mm	8 mm
内存密度	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bi	2097152 bi	2097152 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	44	48	48	44	44	44	44	44	48	48
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C
组织	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSOP2	LFBGA	LFBGA	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	LFBGA	LFBGA
封装等效代码	TSOP44,.46,32	BGA48,6X8,30	BGA48,6X8,30	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	BGA48,6X8,30	BGA48,6X8,30
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.35 mm	1.35 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.35 mm	1.35 mm
最大待机电流	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
最小待机电流	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
最大压摆率	0.06 mA	0.04 mA	0.02 mA	0.04 mA	0.03 mA	0.05 mA	0.02 mA	0.04 mA	0.03 mA	0.05 mA
最大供电电压 (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
最小供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.8 mm	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.75 mm	0.75 mm
端子位置	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	10.16 mm	6 mm	6 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	6 mm	6 mm
厂商名称	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )