型号
- 型号
- 关键词
Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48
器件类别：存储
厂商名称：Integrated Silicon Solution ( ISSI )
下载文档| 型号 | IS62LV12816ALL-10B | IS62LV12816ALL-10BI | IS62LV12816ALL-10TI | IS62LV12816ALL-70T | IS62LV12816ALL-70TI | IS62LV12816ALL-10T | IS62LV12816ALL-55TI | IS62LV12816ALL-55T | IS62LV12816ALL-70B | IS62LV12816ALL-70BI |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 | Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 | Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 128KX16, 70ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 128KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 128KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 | Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | BGA | BGA |
| 包装说明 | 6 X 8 MM, MINI, BGA-48 | 6 X 8 MM, MINI, BGA-48 | TSOP2-44 | TSOP2-44 | TSOP2-44 | TSOP2-44 | TSOP2-44 | TSOP2-44 | 6 X 8 MM, MINI, BGA-48 | 6 X 8 MM, MINI, BGA-48 |
| 针数 | 48 | 48 | 44 | 44 | 44 | 44 | 44 | 44 | 48 | 48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli | compli | compli |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 100 ns | 100 ns | 100 ns | 70 ns | 70 ns | 100 ns | 55 ns | 55 ns | 70 ns | 70 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PBGA-B48 | R-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PBGA-B48 | R-PBGA-B48 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 8 mm | 8 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 8 mm | 8 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bi | 2097152 bi | 2097152 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 44 | 44 | 44 | 44 | 44 | 44 | 48 | 48 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | LFBGA | LFBGA |
| 封装等效代码 | BGA48,6X8,30 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | BGA48,6X8,30 | BGA48,6X8,30 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.35 mm | 1.35 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.35 mm | 1.35 mm |
| 最大待机电流 | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
| 最小待机电流 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 最大压摆率 | 0.02 mA | 0.04 mA | 0.04 mA | 0.03 mA | 0.05 mA | 0.02 mA | 0.06 mA | 0.04 mA | 0.03 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 0.75 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.75 mm |
| 端子位置 | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6 mm | 6 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 6 mm | 6 mm |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |