型号 | LP621024DV-55LL | LP621024DX-70LL | LP621024DV-70LL | LP621024DM-70LL | LP621024DM-55LL | LP621024DX-55LL | LP621024D-70LL | LP621024D-55LL | LP621024D |
---|---|---|---|---|---|---|---|---|---|
描述 | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM | 128K X 8 BIT CMOS SRAM |
是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | - | - | 含铅 | - |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - | - | 不符合 | - |
厂商名称 | AMICC [AMIC TECHNOLOGY] | - | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | - | - | AMICC [AMIC TECHNOLOGY] | - |
零件包装代码 | TSOP1 | - | TSOP1 | SOIC | SOIC | - | - | DIP | - |
包装说明 | TSOP1, TSSOP32,.8,20 | - | TSOP1, TSSOP32,.8,20 | SOP, SOP32,.56 | SOP, SOP32,.56 | - | - | DIP, DIP32,.6 | - |
针数 | 32 | - | 32 | 32 | 32 | - | - | 32 | - |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | - | - | unknow | - |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | - | EAR99 | - |
最长访问时间 | 55 ns | - | 70 ns | 70 ns | 55 ns | - | - | 55 ns | - |
I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | - | - | COMMON | - |
JESD-30 代码 | R-PDSO-G32 | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | - | - | R-PDIP-T32 | - |
长度 | 18.4 mm | - | 18.4 mm | 20.45 mm | 20.45 mm | - | - | 41.91 mm | - |
内存密度 | 1048576 bi | - | 1048576 bi | 1048576 bi | 1048576 bi | - | - | 1048576 bi | - |
内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | - | STANDARD SRAM | - |
内存宽度 | 8 | - | 8 | 8 | 8 | - | - | 8 | - |
功能数量 | 1 | - | 1 | 1 | 1 | - | - | 1 | - |
端子数量 | 32 | - | 32 | 32 | 32 | - | - | 32 | - |
字数 | 131072 words | - | 131072 words | 131072 words | 131072 words | - | - | 131072 words | - |
字数代码 | 128000 | - | 128000 | 128000 | 128000 | - | - | 128000 | - |
工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - | ASYNCHRONOUS | - |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | - | - | 70 °C | - |
组织 | 128KX8 | - | 128KX8 | 128KX8 | 128KX8 | - | - | 128KX8 | - |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - | - | 3-STATE | - |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - |
封装代码 | TSOP1 | - | TSOP1 | SOP | SOP | - | - | DIP | - |
封装等效代码 | TSSOP32,.8,20 | - | TSSOP32,.8,20 | SOP32,.56 | SOP32,.56 | - | - | DIP32,.6 | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | - |
封装形式 | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | - | - | IN-LINE | - |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | - | - | PARALLEL | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | - |
电源 | 5 V | - | 5 V | 5 V | 5 V | - | - | 5 V | - |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | - |
座面最大高度 | 1.2 mm | - | 1.2 mm | 3 mm | 3 mm | - | - | 5.33 mm | - |
最大待机电流 | 0.00001 A | - | 0.00001 A | 0.00001 A | 0.00001 A | - | - | 0.00001 A | - |
最小待机电流 | 2 V | - | 2 V | 2 V | 2 V | - | - | 2 V | - |
最大压摆率 | 0.07 mA | - | 0.07 mA | 0.07 mA | 0.07 mA | - | - | 0.07 mA | - |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V | - |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - | - | 4.5 V | - |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | - | - | 5 V | - |
表面贴装 | YES | - | YES | YES | YES | - | - | NO | - |
技术 | CMOS | - | CMOS | CMOS | CMOS | - | - | CMOS | - |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | COMMERCIAL | - |
端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | - | - | THROUGH-HOLE | - |
端子节距 | 0.5 mm | - | 0.5 mm | 1.27 mm | 1.27 mm | - | - | 2.54 mm | - |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | - | - | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | - |
宽度 | 8 mm | - | 8 mm | 11.3 mm | 11.3 mm | - | - | 15.24 mm | - |