型号
- 型号
- 关键词
HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
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| 型号 | M54HC132F1 | M74HC132F1 | M74HC132B1N | M74HC132C1 | M74HC132M1 |
|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PQCC20, PLASTIC, CC-20 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | DIP | DIP | DIP | QFN | SOIC |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | PLASTIC, CC-20 | MICRO, PLASTIC, GULLWING, DIP-14 |
| 针数 | 14 | 14 | 14 | 20 | 14 |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-PDIP-T14 | S-PQCC-J20 | R-PDSO-G14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 20 | 14 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | QCCJ | SOP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | LDCC20,.4SQ | SOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 传播延迟（tpd） | 38 ns | 31 ns | 31 ns | 31 ns | 31 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | YES | YES | YES | YES | YES |
| 座面最大高度 | 5 mm | 5 mm | 5.1 mm | 4.57 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 8.9662 mm | 3.9 mm |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| Prop。Delay @ Nom-Sup | 38 ns | - | 31 ns | 31 ns | 31 ns |
