型号
- 型号
- 关键词
128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories
厂商名称：ST(意法半导体)
厂商官网：http://www.st.com/
器件标准：
| 型号 | M58LT128GSB1ZA5E | M58LT128GS | M58LT128GSB | M58LT128GSB1ZA5F | M58LT128GST | M58LT128GST1ZA5 | M58LT128GST1ZA5E | M58LT128GST1ZA5F |
|---|---|---|---|---|---|---|---|---|
| 描述 | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories | 128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories |
| 是否Rohs认证 | 符合 | - | - | 符合 | - | 不符合 | 符合 | 符合 |
| 厂商名称 | ST(意法半导体) | - | - | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | BGA | - | - | BGA | - | BGA | BGA | BGA |
| 包装说明 | 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64 | - | - | 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64 | - | 10 X 13 MM, 1 MM PITCH, TBGA-64 | 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64 | 10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64 |
| 针数 | 64 | - | - | 64 | - | 64 | 64 | 64 |
| Reach Compliance Code | compli | - | - | compli | - | _compli | compli | compli |
| ECCN代码 | 3A991.B.1.A | - | - | 3A991.B.1.A | - | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 最长访问时间 | 110 ns | - | - | 110 ns | - | 110 ns | 110 ns | 110 ns |
| 其他特性 | ALSO OPERATES IN SYNC-REGISTERED MODE | - | - | ALSO OPERATES IN SYNC-REGISTERED MODE | - | ALSO OPERATES IN SYNC-REGISTERED MODE | ALSO OPERATES IN SYNC-REGISTERED MODE | ALSO OPERATES IN SYNC-REGISTERED MODE |
| 启动块 | BOTTOM | - | - | BOTTOM | - | TOP | TOP | TOP |
| 命令用户界面 | YES | - | - | YES | - | YES | YES | YES |
| 通用闪存接口 | YES | - | - | YES | - | YES | YES | YES |
| 数据轮询 | NO | - | - | NO | - | NO | NO | NO |
| JESD-30 代码 | R-PBGA-B64 | - | - | R-PBGA-B64 | - | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 |
| 长度 | 13 mm | - | - | 13 mm | - | 13 mm | 13 mm | 13 mm |
| 内存密度 | 134217728 bi | - | - | 134217728 bi | - | 134217728 bi | 134217728 bi | 134217728 bi |
| 内存集成电路类型 | FLASH | - | - | FLASH | - | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | - | - | 16 | - | 16 | 16 | 16 |
| 功能数量 | 1 | - | - | 1 | - | 1 | 1 | 1 |
| 部门数/规模 | 4,127 | - | - | 4,127 | - | 4,127 | 4,127 | 4,127 |
| 端子数量 | 64 | - | - | 64 | - | 64 | 64 | 64 |
| 字数 | 8388608 words | - | - | 8388608 words | - | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | - | - | 8000000 | - | 8000000 | 8000000 | 8000000 |
| 工作模式 | ASYNCHRONOUS | - | - | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | - | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | - | - | -25 °C | - | -25 °C | -25 °C | -25 °C |
| 组织 | 8MX16 | - | - | 8MX16 | - | 8MX16 | 8MX16 | 8MX16 |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TBGA | - | - | TBGA | - | TBGA | TBGA | TBGA |
| 封装等效代码 | BGA64,8X8,40 | - | - | BGA64,8X8,40 | - | BGA64,8X8,40 | BGA64,8X8,40 | BGA64,8X8,40 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE | - | - | GRID ARRAY, THIN PROFILE | - | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
| 页面大小 | 8 words | - | - | 8 words | - | 8 words | 8 words | 8 words |
| 并行/串行 | PARALLEL | - | - | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | - | - | 260 | - | 240 | 260 | 260 |
| 电源 | 1.8,3/3.3 V | - | - | 1.8,3/3.3 V | - | 1.8,3/3.3 V | 1.8,3/3.3 V | 1.8,3/3.3 V |
| 编程电压 | 1.8 V | - | - | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | - | - | 1.2 mm | - | 1.2 mm | 1.2 mm | 1.2 mm |
| 部门规模 | 16K,64K | - | - | 16K,64K | - | 16K,64K | 16K,64K | 16K,64K |
| 最大待机电流 | 0.000005 A | - | - | 0.000005 A | - | 0.000005 A | 0.000005 A | 0.000005 A |
| 最大压摆率 | 0.047 mA | - | - | 0.047 mA | - | 0.047 mA | 0.047 mA | 0.047 mA |
| 最大供电电压 (Vsup) | 2 V | - | - | 2 V | - | 2 V | 2 V | 2 V |
| 最小供电电压 (Vsup) | 1.7 V | - | - | 1.7 V | - | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | - | - | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | - | YES | - | YES | YES | YES |
| 技术 | CMOS | - | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | - | - | OTHER | - | OTHER | OTHER | OTHER |
| 端子形式 | BALL | - | - | BALL | - | BALL | BALL | BALL |
| 端子节距 | 1 mm | - | - | 1 mm | - | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | - | - | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | - | - | 40 | - | 30 | 40 | 40 |
| 切换位 | NO | - | - | NO | - | NO | NO | NO |
| 类型 | NOR TYPE | - | - | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 10 mm | - | - | 10 mm | - | 10 mm | 10 mm | 10 mm |