型号
- 型号
- 关键词
512KX8 FLASH 5V PROM, 120ns, PQCC32, PLASTIC, LCC-32
厂商名称：FUJITSU(富士通)
厂商官网：http://edevice.fujitsu.com/fmd/en/index.html
下载文档| 型号 | MBM29F040A-12PD-X | MBM29F040A-90PFTR-X | MBM29F040A-12PFTN-X | MBM29F040A-90PD-X |
|---|---|---|---|---|
| 描述 | 512KX8 FLASH 5V PROM, 120ns, PQCC32, PLASTIC, LCC-32 | Flash, 512KX8, 90ns, PDSO32, PLASTIC, REVERSE, TSOP-32 | 512KX8 FLASH 5V PROM, 120ns, PDSO32, PLASTIC, TSOP-32 | Flash, 512KX8, 90ns, PQCC32, PLASTIC, LCC-32 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC32,.5X.6 | PLASTIC, REVERSE, TSOP-32 | TSOP1, TSSOP32,.8,20 | PLASTIC, LCC-32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 120 ns | 90 ns | 120 ns | 90 ns |
| 其他特性 | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE |
| 命令用户界面 | YES | YES | YES | YES |
| 数据轮询 | YES | YES | YES | YES |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 13.97 mm | 18.4 mm | 18.4 mm | 13.97 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 8 | 8 | 8 | 8 |
| 端子数量 | 32 | 32 | 32 | 32 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | TSOP1-R | TSOP1 | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 | TSSOP32,.8,20 | TSSOP32,.8,20 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.56 mm | 1.2 mm | 1.2 mm | 3.56 mm |
| 部门规模 | 64K | 64K | 64K | 64K |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD |
| 切换位 | YES | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 11.43 mm | 8 mm | 8 mm | 11.43 mm |
51单片机
单片机
FPGA/CPLD
无线连接
嵌入式系统
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