512KX8 FLASH 5V PROM, 120ns, PDSO32, PLASTIC, TSOP-32
厂商名称:FUJITSU(富士通)
厂商官网:http://edevice.fujitsu.com/fmd/en/index.html
下载文档型号 | MBM29F040A-12PFTN-X | MBM29F040A-90PFTR-X | MBM29F040A-90PD-X | MBM29F040A-12PD-X |
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描述 | 512KX8 FLASH 5V PROM, 120ns, PDSO32, PLASTIC, TSOP-32 | Flash, 512KX8, 90ns, PDSO32, PLASTIC, REVERSE, TSOP-32 | Flash, 512KX8, 90ns, PQCC32, PLASTIC, LCC-32 | 512KX8 FLASH 5V PROM, 120ns, PQCC32, PLASTIC, LCC-32 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | TSOP1, TSSOP32,.8,20 | PLASTIC, REVERSE, TSOP-32 | PLASTIC, LCC-32 | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 120 ns | 90 ns | 90 ns | 120 ns |
其他特性 | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE | MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE |
命令用户界面 | YES | YES | YES | YES |
数据轮询 | YES | YES | YES | YES |
耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PQCC-J32 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 18.4 mm | 18.4 mm | 13.97 mm | 13.97 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
部门数/规模 | 8 | 8 | 8 | 8 |
端子数量 | 32 | 32 | 32 | 32 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP1 | TSOP1-R | QCCJ | QCCJ |
封装等效代码 | TSSOP32,.8,20 | TSSOP32,.8,20 | LDCC32,.5X.6 | LDCC32,.5X.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 3.56 mm | 3.56 mm |
部门规模 | 64K | 64K | 64K | 64K |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
端子形式 | GULL WING | GULL WING | J BEND | J BEND |
端子节距 | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD |
切换位 | YES | YES | YES | YES |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 8 mm | 8 mm | 11.43 mm | 11.43 mm |