型号
- 型号
- 关键词
D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18
厂商名称：Exar
下载文档| 型号 | MP7541ATD | MP7541JN | MP7541AKN | MP7541TD | MP7541JS | MP7541AAD | MP7541SD |
|---|---|---|---|---|---|---|---|
| 描述 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDIP18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDSO18 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Exar | Exar | Exar | Exar | Exar | Exar | Exar |
| 零件包装代码 | DIP | DIP | DIP | DIP | SOIC | DIP | DIP |
| 包装说明 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | SOP, SOP18,.4 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| 针数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | - |
| 输入位码 | BINARY | BINARY | BINARY | - | BINARY | BINARY | - |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | - |
| JESD-30 代码 | R-GDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | - | R-PDSO-G18 | R-GDIP-T18 | - |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | - |
| 最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0122% | - | 0.0244% | 1% | - |
| 位数 | 12 | 12 | 12 | - | 12 | 12 | - |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | - |
| 端子数量 | 18 | 18 | 18 | - | 18 | 18 | - |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | - |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DIP | DIP | DIP | - | SOP | DIP | - |
| 封装等效代码 | DIP18,.3 | DIP18,.3 | DIP18,.3 | - | SOP18,.4 | DIP18,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | - | SMALL OUTLINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 15 V | 15 V | 15 V | - | 15 V | 15 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | - | 2.65 mm | 5.08 mm | - |
| 最大稳定时间 | 1 µs | 1 µs | 1 µs | - | 1 µs | 1 µs | - |
| 最大压摆率 | 2 mA | 2 mA | 2 mA | - | 2 mA | 2 mA | - |
| 标称供电电压 | 15 V | 15 V | 15 V | - | 15 V | 15 V | - |
| 表面贴装 | NO | NO | NO | - | YES | NO | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | - |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | - | 7.5 mm | 7.62 mm | - |