首页 > 器件类别 > 模拟混合信号IC > 转换器

MP7541SD

D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18

器件类别:模拟混合信号IC    转换器   

厂商名称:Exar

下载文档
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Exar
零件包装代码
DIP
包装说明
DIP, DIP18,.3
针数
18
Reach Compliance Code
unknow
ECCN代码
3A001.A.2.C
参数对比
与MP7541SD相近的元器件有:MP7541JN、MP7541AKN、MP7541ATD、MP7541TD、MP7541JS、MP7541AAD。描述及对比如下:
型号 MP7541SD MP7541JN MP7541AKN MP7541ATD MP7541TD MP7541JS MP7541AAD
描述 D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18 D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDIP18, 0.300 INCH, PLASTIC, DIP-18 D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDIP18 D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18 D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18 D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDSO18 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP18, 0.300 INCH, CERAMIC, DIP-18
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 Exar Exar Exar Exar Exar Exar Exar
零件包装代码 DIP DIP DIP DIP DIP SOIC DIP
包装说明 DIP, DIP18,.3 DIP, DIP18,.3 DIP, DIP18,.3 DIP, DIP18,.3 DIP, DIP18,.3 SOP, SOP18,.4 DIP, DIP18,.3
针数 18 18 18 18 18 18 18
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown
转换器类型 - D/A CONVERTER D/A CONVERTER D/A CONVERTER - D/A CONVERTER D/A CONVERTER
输入位码 - BINARY BINARY BINARY - BINARY BINARY
输入格式 - PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD - PARALLEL, WORD PARALLEL, WORD
JESD-30 代码 - R-PDIP-T18 R-PDIP-T18 R-GDIP-T18 - R-PDSO-G18 R-GDIP-T18
JESD-609代码 - e0 e0 e0 - e0 e0
最大线性误差 (EL) - 0.0244% 0.0122% 0.0122% - 0.0244% 1%
位数 - 12 12 12 - 12 12
功能数量 - 1 1 1 - 1 1
端子数量 - 18 18 18 - 18 18
最高工作温度 - 85 °C 85 °C 125 °C - 85 °C 85 °C
最低工作温度 - -40 °C -40 °C -55 °C - -40 °C -40 °C
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED - PLASTIC/EPOXY CERAMIC, GLASS-SEALED
封装代码 - DIP DIP DIP - SOP DIP
封装等效代码 - DIP18,.3 DIP18,.3 DIP18,.3 - SOP18,.4 DIP18,.3
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 - IN-LINE IN-LINE IN-LINE - SMALL OUTLINE IN-LINE
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
电源 - 15 V 15 V 15 V - 15 V 15 V
认证状态 - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 - 5.08 mm 5.08 mm 5.08 mm - 2.65 mm 5.08 mm
最大稳定时间 - 1 µs 1 µs 1 µs - 1 µs 1 µs
最大压摆率 - 2 mA 2 mA 2 mA - 2 mA 2 mA
标称供电电压 - 15 V 15 V 15 V - 15 V 15 V
表面贴装 - NO NO NO - YES NO
技术 - CMOS CMOS CMOS - CMOS CMOS
温度等级 - INDUSTRIAL INDUSTRIAL MILITARY - INDUSTRIAL INDUSTRIAL
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE - GULL WING THROUGH-HOLE
端子节距 - 2.54 mm 2.54 mm 2.54 mm - 1.27 mm 2.54 mm
端子位置 - DUAL DUAL DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
宽度 - 7.62 mm 7.62 mm 7.62 mm - 7.5 mm 7.62 mm
热门器件
热门资源推荐
器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
需要登录后才可以下载。
登录取消