D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18
厂商名称:Exar
下载文档型号 | MP7541TD | MP7541JN | MP7541AKN | MP7541ATD | MP7541JS | MP7541AAD | MP7541SD |
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描述 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDIP18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, PDSO18 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.5us Settling Time, CDIP18, 0.300 INCH, CERAMIC, DIP-18 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Exar | Exar | Exar | Exar | Exar | Exar | Exar |
零件包装代码 | DIP | DIP | DIP | DIP | SOIC | DIP | DIP |
包装说明 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | SOP, SOP18,.4 | DIP, DIP18,.3 | DIP, DIP18,.3 |
针数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
转换器类型 | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - |
输入位码 | - | BINARY | BINARY | BINARY | BINARY | BINARY | - |
输入格式 | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - |
JESD-30 代码 | - | R-PDIP-T18 | R-PDIP-T18 | R-GDIP-T18 | R-PDSO-G18 | R-GDIP-T18 | - |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | - |
最大线性误差 (EL) | - | 0.0244% | 0.0122% | 0.0122% | 0.0244% | 1% | - |
位数 | - | 12 | 12 | 12 | 12 | 12 | - |
功能数量 | - | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | - | 18 | 18 | 18 | 18 | 18 | - |
最高工作温度 | - | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | - |
最低工作温度 | - | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | - |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - |
封装代码 | - | DIP | DIP | DIP | SOP | DIP | - |
封装等效代码 | - | DIP18,.3 | DIP18,.3 | DIP18,.3 | SOP18,.4 | DIP18,.3 | - |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | - | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | - |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
电源 | - | 15 V | 15 V | 15 V | 15 V | 15 V | - |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | - | 5.08 mm | 5.08 mm | 5.08 mm | 2.65 mm | 5.08 mm | - |
最大稳定时间 | - | 1 µs | 1 µs | 1 µs | 1 µs | 1 µs | - |
最大压摆率 | - | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | - |
标称供电电压 | - | 15 V | 15 V | 15 V | 15 V | 15 V | - |
表面贴装 | - | NO | NO | NO | YES | NO | - |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | - |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - |
端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | - |
端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.62 mm | - |