型号
- 型号
- 关键词
| 型号 | MSC2331A-10KS3 | MSC2331B-70KS3 | MSC2331B-10YS3 | MSC2331B-70YS3 | MSC2331A-1AKS3 | MSC2331A-80KS3 | MSC2331A-8AKS3 |
|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 256KX9, 100ns, CMOS | Fast Page DRAM Module, 256KX9, 70ns, CMOS, | Fast Page DRAM Module, 256KX9, 100ns, CMOS, PSMA30, | Fast Page DRAM Module, 256KX9, 70ns, CMOS, PSMA30, | Fast Page DRAM Module, 256KX9, 100ns, CMOS | Fast Page DRAM Module, 256KX9, 80ns, CMOS, | Fast Page DRAM Module, 256KX9, 80ns, CMOS |
| 包装说明 | , SIP30,.2 | , SIP30,.2 | SIMM, SIM30 | SIMM, SIM30 | , SIP30,.2 | , SIP30,.2 | , SIP30,.2 |
| Reach Compliance Code | unknown | unknown | unknown | unknow | unknown | unknown | unknown |
| 最长访问时间 | 100 ns | 70 ns | 100 ns | 70 ns | 100 ns | 80 ns | 80 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| 内存密度 | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bi | 2359296 bit | 2359296 bit | 2359296 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 端子数量 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX9 | 256KX9 | 256KX9 | 256KX9 | 256KX9 | 256KX9 | 256KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装等效代码 | SIP30,.2 | SIP30,.2 | SIM30 | SIM30 | SIP30,.2 | SIP30,.2 | SIP30,.2 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 最大待机电流 | 0.0045 A | 0.004 A | 0.004 A | 0.004 A | 0.0045 A | 0.0045 A | 0.0045 A |
| 最大压摆率 | 0.21 mA | 0.225 mA | 0.165 mA | 0.225 mA | 0.21 mA | 0.21 mA | 0.21 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| Objectid | 1164051329 | - | - | - | 1164051331 | 1164051333 | 1164051335 |
| ECCN代码 | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 |
| 座面最大高度 | 19.4818 mm | 19.4818 mm | 16.51 mm | 16.51 mm | - | 19.4818 mm | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
