型号
- 型号
- 关键词
| 型号 | MSM51C256-12JS | MSM51C256A-80RS | MSM51C256A-70RS | MSM51C256-80JS | MSM51C256-8RS | MSM51C256-12RS | MSM51C256A-10RS | MSM51C256-10RS |
|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM, 256KX1, 120ns, CMOS, PQCC18 | Fast Page DRAM, 256KX1, 80ns, CMOS, PDIP16 | Fast Page DRAM, 256KX1, 70ns, CMOS, PDIP16 | Memory IC | Fast Page DRAM, 256KX1, 80ns, CMOS, PDIP16 | Fast Page DRAM, 256KX1, 120ns, CMOS, PDIP16 | Fast Page DRAM, 256KX1, 100ns, CMOS, PDIP16 | Fast Page DRAM, 256KX1, 100ns, CMOS, PDIP16, |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | QCCJ, LDCC18,.33X.53 | DIP, DIP16,.3 | DIP, DIP16,.3 | , | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 最长访问时间 | 120 ns | 80 ns | 70 ns | - | 80 ns | 120 ns | 100 ns | 100 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PQCC-J18 | R-PDIP-T16 | R-PDIP-T16 | - | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | - | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | - | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 16 | 16 | - | 16 | 16 | 16 | 16 |
| 字数 | 262144 words | 262144 words | 262144 words | - | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | - | 256000 | 256000 | 256000 | 256000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX1 | 256KX1 | 256KX1 | - | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP | - | DIP | DIP | DIP | DIP |
| 封装等效代码 | LDCC18,.33X.53 | DIP16,.3 | DIP16,.3 | - | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 256 | 256 | 256 | - | 256 | 256 | 256 | 256 |
| 最大压摆率 | 0.045 mA | 0.055 mA | 0.065 mA | - | 0.06 mA | 0.045 mA | 0.045 mA | 0.05 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | - | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
