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PDTC143EK-T

TRANSISTOR 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236, PLASTIC, SC-59A, 3 PIN, BIP General Purpose Small Signal

器件类别:分立半导体    晶体管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
NXP(恩智浦)
零件包装代码
SOT-23
包装说明
SMALL OUTLINE, R-PDSO-G3
针数
3
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
BUILT IN BIAS RESISTANCE RATIO IS 1
最大集电极电流 (IC)
0.1 A
集电极-发射极最大电压
50 V
配置
SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE)
30
JEDEC-95代码
TO-236
JESD-30 代码
R-PDSO-G3
元件数量
1
端子数量
3
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
极性/信道类型
NPN
认证状态
Not Qualified
表面贴装
YES
端子形式
GULL WING
端子位置
DUAL
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
DISCRETE SEMICONDUCTORS
DATA SHEET
PDTC143E series
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 4.7 kΩ
Product data sheet
Supersedes data of 2004 Mar 18
2004 Aug 05
NXP Semiconductors
Product data sheet
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 4.7 kΩ
FEATURES
Built-in bias resistors
Simplified circuit design
Reduction of component count
Reduced pick and place costs.
APPLICATIONS
General purpose switching and amplification
Inverter and interface circuits
Circuit driver.
DESCRIPTION
PDTC143E series
QUICK REFERENCE DATA
SYMBOL
V
CEO
I
O
R1
R2
PARAMETER
collector-emitter
voltage
output current (DC)
bias resistor
bias resistor
TYP.
4.7
4.7
MAX.
50
100
UNIT
V
mA
NPN resistor-equipped transistor (see “Simplified outline,
symbol and pinning” for package details).
PRODUCT OVERVIEW
PACKAGE
TYPE NUMBER
PHILIPS
PDTC143EE
PDTC143EEF
PDTC143EK
PDTC143EM
PDTC143ES
PDTC143ET
PDTC143EU
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
SOT416
SOT490
SOT346
SOT883
SOT54 (TO-92)
SOT23
SOT323
EIAJ
SC-75
SC-89
SC-59
SC-101
SC-43
SC-70
02
51
02
E1
TC143E
*02
*02
PDTA143EE
PDTA143EEF
PDTA143EK
PDTA143EM
PDTA143ES
PDTA143ET
PDTA143EU
MARKING CODE
(1)
PNP COMPLEMENT
2004 Aug 05
2
NXP Semiconductors
Product data sheet
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 4.7 kΩ
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PDTC143E series
PINNING
TYPE NUMBER
PDTC143ES
handbook, halfpage
SIMPLIFIED OUTLINE AND SYMBOL
PIN
1
2
2
R1
1
R2
3
MAM364
DESCRIPTION
base
collector
emitter
1
2
3
3
PDTC143EE
PDTC143EEF
PDTC143EK
PDTC143ET
PDTC143EU
1
Top view
2
MDB269
1
2
handbook, halfpage
base
emitter
collector
3
R1
1
R2
3
3
2
PDTC143EM
handbook, halfpage
1
2
3
R1
1
3
1
bottom view
MHC506
base
emitter
collector
3
2
R2
2
2004 Aug 05
3
NXP Semiconductors
Product data sheet
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 4.7 kΩ
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PDTC143EE
PDTC143EEF
PDTC143EK
PDTC143EM
PDTC143ES
PDTC143ET
PDTC143EU
DESCRIPTION
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
PDTC143E series
VERSION
SOT416
SOT490
SOT346
SOT883
SOT54
SOT23
SOT323
leadless ultra small plastic package; 3 solder lands; body
1.0
×
0.6
×
0.5 mm
plastic single-ended leaded (through hole) package; 3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
V
CBO
V
CEO
V
EBO
V
I
PARAMETER
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage
positive
negative
I
O
I
CM
P
tot
output current (DC)
peak collector current
total power dissipation
SOT54
SOT23
SOT346
SOT323
SOT416
SOT883
SOT490
T
stg
T
j
T
amb
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60
μm
copper strip line.
storage temperature
junction temperature
operating ambient temperature
T
amb
25
°C
note 1
note 1
note 1
note 1
note 1
notes 2 and 3
notes 1 and 2
−65
−65
500
250
250
200
150
250
250
+150
150
+150
mW
mW
mW
mW
mW
mW
mW
°C
°C
°C
+30
−10
100
100
V
V
mA
mA
CONDITIONS
open emitter
open base
open collector
MIN.
MAX.
50
50
10
V
V
V
UNIT
2004 Aug 05
4
NXP Semiconductors
Product data sheet
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 4.7 kΩ
THERMAL CHARACTERISTICS
SYMBOL
R
th(j-a)
SOT54
SOT23
SOT346
SOT323
SOT416
SOT883
SOT490
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60
μm
copper strip line.
CHARACTERISTICS
T
amb
= 25
°C
unless otherwise specified.
SYMBOL
I
CBO
I
CEO
I
EBO
h
FE
V
CEsat
V
i(off)
V
i(on)
R1
R2
-------
-
R1
C
c
PARAMETER
collector-base cut-off current
collector-emitter cut-off current
emitter-base cut-off current
DC current gain
input-off voltage
input-on voltage
input resistor
resistor ratio
collector capacitance
I
E
= i
e
= 0 A; V
CB
= 10 V;
f = 1 MHz
CONDITIONS
V
CB
= 50 V; I
E
= 0 A
V
CE
= 30 V; I
B
= 0 A
V
CE
= 30 V; I
B
= 0 A; T
j
= 150
°C
V
EB
= 5 V; I
C
= 0 A
V
CE
= 5 V; I
C
= 10 mA
I
C
= 100
μA;
V
CE
= 5 V
I
C
= 20 mA; V
CE
= 0.3 V
PARAMETER
thermal resistance from junction to ambient
CONDITIONS
in free air
note 1
note 1
note 1
note 1
note 1
notes 2 and 3
notes 1 and 2
PDTC143E series
VALUE
250
500
500
625
833
500
500
UNIT
K/W
K/W
K/W
K/W
K/W
K/W
K/W
MIN.
30
2.5
3.3
0.8
TYP.
1.1
1.9
4.7
1
MAX.
100
1
50
900
150
0.5
6.1
1.2
2.5
UNIT
nA
μA
μA
μA
mV
V
V
collector-emitter saturation voltage I
C
= 10 mA; I
B
= 0.5 mA
pF
2004 Aug 05
5
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参数对比
与PDTC143EK-T相近的元器件有:PDTC143EK,115、PDTC143ES,126、PDTC143EEF,115、PDTC143EK/T4。描述及对比如下:
型号 PDTC143EK-T PDTC143EK,115 PDTC143ES,126 PDTC143EEF,115 PDTC143EK/T4
描述 TRANSISTOR 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236, PLASTIC, SC-59A, 3 PIN, BIP General Purpose Small Signal TRANS PREBIAS NPN 250MW SMT3 TRANS PREBIAS NPN 500MW TO92-3 TRANS PREBIAS NPN 250MW SC89 TRANSISTOR 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236, PLASTIC, SC-59A, 3 PIN, BIP General Purpose Small Signal
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SOT-23 SMT TO-92 SC-89 SOT-23
包装说明 SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G3 CHIP CARRIER, R-PBCC-N3 SMALL OUTLINE, R-PDSO-F3 SMALL OUTLINE, R-PDSO-G3
针数 3 3 3 3 3
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 BUILT IN BIAS RESISTANCE RATIO IS 1 BUILT-IN BIAS RESISTOR RATIO IS 1 BUILT-IN BIAS RESISTOR RATIO IS 1 BUILT-IN BIAS RESISTOR RATIO IS 1 BUILT IN BIAS RESISTANCE RATIO IS 1
最大集电极电流 (IC) 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A
集电极-发射极最大电压 50 V 50 V 50 V 50 V 50 V
配置 SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE) 30 30 30 30 30
JESD-30 代码 R-PDSO-G3 R-PDSO-G3 R-PBCC-N3 R-PDSO-F3 R-PDSO-G3
元件数量 1 1 1 1 1
端子数量 3 3 3 3 3
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE CHIP CARRIER SMALL OUTLINE SMALL OUTLINE
极性/信道类型 NPN NPN NPN NPN NPN
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES
端子形式 GULL WING GULL WING NO LEAD FLAT GULL WING
端子位置 DUAL DUAL BOTTOM DUAL DUAL
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON
JEDEC-95代码 TO-236 TO-236 TO-92 - TO-236
JESD-609代码 - e3 e3 e3 -
端子面层 - TIN TIN TIN -
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