型号
- 型号
- 关键词
Microcontroller, 8-Bit, MROM, 10MHz, MOS, PQFP64, 12 X 12 MM, PLASTIC, LQFP-64
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：NEC(日电)
下载文档| 型号 | UPD78011HGK(A)-XXX-8A8 | UPD78014HGK(A)-XXX-8A8 | UPD78012HCW(A)-XXX | UPD78013HCW(A)-XXX | UPD78P018FKK-S | UPD78012HGK(A)-XXX-8A8 | UPD78013HGK(A)-XXX-8A8 |
|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PQFP64, 12 X 12 MM, PLASTIC, LQFP-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PQFP64, 12 X 12 MM, PLASTIC, LQFP-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PDIP64, 0.750 INCH, PLASTIC, SDIP-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PDIP64, 0.750 INCH, PLASTIC, SDIP-64 | Microcontroller, 8-Bit, UVPROM, 10MHz, MOS, CQCC64, 14 X 14 MM, WINDOWED, CERAMIC, QFN-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PQFP64, 12 X 12 MM, PLASTIC, LQFP-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PQFP64, 12 X 12 MM, PLASTIC, LQFP-64 |
| 厂商名称 | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) |
| 零件包装代码 | QFP | QFP | DIP | DIP | QFN | QFP | QFP |
| 包装说明 | LQFP, | LQFP, | 0.750 INCH, PLASTIC, SDIP-64 | 0.750 INCH, PLASTIC, SDIP-64 | 14 X 14 MM, WINDOWED, CERAMIC, QFN-64 | LQFP, | LQFP, |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown | unknown |
| 具有ADC | YES | YES | YES | YES | YES | YES | YES |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 17 | 16 | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | R-PDIP-T64 | R-PDIP-T64 | S-CQCC-N64 | S-PQFP-G64 | S-PQFP-G64 |
| 长度 | 12 mm | 12 mm | 58 mm | 58 mm | 14 mm | 12 mm | 12 mm |
| I/O 线路数量 | 53 | 53 | 53 | 53 | 53 | 53 | 53 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | SDIP | SDIP | WQCCN | LQFP | LQFP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | CHIP CARRIER, WINDOW | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | MROM | UVPROM | MROM | MROM |
| 座面最大高度 | 1.7 mm | 1.7 mm | 5.08 mm | 5.08 mm | 3.56 mm | 1.7 mm | 1.7 mm |
| 速度 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.7 V | 1.8 V | 1.8 V |
| 标称供电电压 | 2 V | 2 V | 2 V | 2 V | 3 V | 2 V | 2 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES | YES |
| 技术 | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 1.778 mm | 1.778 mm | 0.8 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD | QUAD |
| 宽度 | 12 mm | 12 mm | 19.05 mm | 19.05 mm | 14 mm | 12 mm | 12 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |