Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, TSOP2-44
厂商名称:Winbond(华邦电子)
厂商官网:http://www.winbond.com.tw
下载文档型号 | W26L04AH-12 | W26L04AJ-10I | W26L04AJ-12 | W26L04AJ-12I | W26L04AH-10 | W26L04AH-12I | W26L04AJ-10 | W26L04AH-10I |
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描述 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 |
厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
零件包装代码 | TSOP2 | SOJ | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | TSOP2 |
包装说明 | TSOP2, | SOJ, | SOJ, | SOJ, | TSOP2, | TSOP2, | SOJ, | TSOP2, |
针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 12 ns | 10 ns | 12 ns | 12 ns | 10 ns | 12 ns | 10 ns | 10 ns |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-G44 |
长度 | 18.41 mm | 28.58 mm | 28.58 mm | 28.58 mm | 18.41 mm | 18.41 mm | 28.58 mm | 18.41 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | SOJ | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 3.759 mm | 3.759 mm | 3.759 mm | 1.2 mm | 1.2 mm | 3.759 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子形式 | GULL WING | J BEND | J BEND | J BEND | GULL WING | GULL WING | J BEND | GULL WING |
端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |