M5LV-384/184-10HC,M5LV-384/184-10HC pdf中文资料,M5LV-384/184-10HC引脚图,M5LV-384/184-10HC电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

AMD(超微)

零件包装代码

QFP

包装说明

HFQFP, HQFP240,1.37SQ,20

针数

240

Reach Compliance Code

unknown

其他特性

PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE

最大时钟频率

58 MHz

系统内可编程

YES

JESD-30 代码

S-PQFP-G240

JESD-609代码

JTAG BST

YES

长度

32 mm

专用输入次数

I/O 线路数量

184

宏单元数

384

端子数量

240

最高工作温度

70 °C

最低工作温度

组织

0 DEDICATED INPUTS, 184 I/O

输出函数

MACROCELL

封装主体材料

PLASTIC/EPOXY

封装代码

HFQFP

封装等效代码

HQFP240,1.37SQ,20

封装形状

SQUARE

封装形式

FLATPACK, HEAT SINK/SLUG, FINE PITCH

峰值回流温度（摄氏度）

NOT SPECIFIED

电源

3.3 V

可编程逻辑类型

EE PLD

传播延迟

16 ns

认证状态

Not Qualified

座面最大高度

4.1 mm

最大供电电压

3.6 V

最小供电电压

3 V

标称供电电压

3.3 V

表面贴装

YES

技术

CMOS

温度等级

COMMERCIAL

端子面层

Tin/Lead (Sn/Pb)

端子形式

GULL WING

端子节距

0.5 mm

端子位置

QUAD

处于峰值回流温度下的最长时间

NOT SPECIFIED

宽度

32 mm

参数对比

与M5LV-384/184-10HC相近的元器件有：M5LV-384/192-10AC、M5LV-384/192-7AC、M5LV-384/192-15AC、M5LV-384/192-12AC、M5LV-384/184-15HC、M5LV-384/184-12HC、M5LV-384/184-7HC。描述及对比如下：

型号	M5LV-384/184-10HC	M5LV-384/192-10AC	M5LV-384/192-7AC	M5LV-384/192-15AC	M5LV-384/192-12AC	M5LV-384/184-15HC	M5LV-384/184-12HC	M5LV-384/184-7HC
描述	EE PLD, 16ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240	EE PLD, 16ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 14ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 20ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 18ns, 384-Cell, CMOS, PBGA256, BGA-256	EE PLD, 20ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240	EE PLD, 18ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240	EE PLD, 14ns, 384-Cell, CMOS, PQFP240, HEAT SINK, PLASTIC, QFP-240
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)
零件包装代码	QFP	BGA	BGA	BGA	BGA	QFP	QFP	QFP
包装说明	HFQFP, HQFP240,1.37SQ,20	LBGA, BGA256,20X20,50	LBGA, BGA256,20X20,50	LBGA, BGA256,20X20,50	LBGA, BGA256,20X20,50	HFQFP, HQFP240,1.37SQ,20	HFQFP, HQFP240,1.37SQ,20	HFQFP, HQFP240,1.37SQ,20
针数	240	256	256	256	256	240	240	240
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE	PAL BLOCKS INTERCONNECTED BY PIA; SHARED INPUT/CLOCK; 4 EXTERNAL CLOCKS; IN-SYSTEM PROGRAMMABLE
最大时钟频率	58 MHz	58 MHz	71 MHz	42 MHz	47.6 MHz	42 MHz	47.6 MHz	71 MHz
系统内可编程	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PQFP-G240	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PQFP-G240	S-PQFP-G240	S-PQFP-G240
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
JTAG BST	YES	YES	YES	YES	YES	YES	YES	YES
长度	32 mm	27 mm	27 mm	27 mm	27 mm	32 mm	32 mm	32 mm
I/O 线路数量	184	192	192	192	192	184	184	184
宏单元数	384	384	384	384	384	384	384	384
端子数量	240	256	256	256	256	240	240	240
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	0 DEDICATED INPUTS, 184 I/O	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 192 I/O	0 DEDICATED INPUTS, 184 I/O	0 DEDICATED INPUTS, 184 I/O	0 DEDICATED INPUTS, 184 I/O
输出函数	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HFQFP	LBGA	LBGA	LBGA	LBGA	HFQFP	HFQFP	HFQFP
封装等效代码	HQFP240,1.37SQ,20	BGA256,20X20,50	BGA256,20X20,50	BGA256,20X20,50	BGA256,20X20,50	HQFP240,1.37SQ,20	HQFP240,1.37SQ,20	HQFP240,1.37SQ,20
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, HEAT SINK/SLUG, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH	FLATPACK, HEAT SINK/SLUG, FINE PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
可编程逻辑类型	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
传播延迟	16 ns	16 ns	14 ns	20 ns	18 ns	20 ns	18 ns	14 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	4.1 mm	1.65 mm	1.65 mm	1.65 mm	1.65 mm	4.1 mm	4.1 mm	4.1 mm
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	BALL	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	QUAD	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	32 mm	27 mm	27 mm	27 mm	27 mm	32 mm	32 mm	32 mm