AM50DL128CH85IS,AM50DL128CH85IS pdf中文资料,AM50DL128CH85IS引脚图,AM50DL128CH85IS电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

厂商名称

AMD(超微)

包装说明

FBGA, BGA88,10X12,32

Reach Compliance Code

compli

最长访问时间

85 ns

JESD-30 代码

R-PBGA-B88

内存集成电路类型

MEMORY CIRCUIT

混合内存类型

FLASH+PSRAM

端子数量

最高工作温度

85 °C

最低工作温度

-40 °C

封装主体材料

PLASTIC/EPOXY

封装代码

FBGA

封装等效代码

BGA88,10X12,32

封装形状

RECTANGULAR

封装形式

GRID ARRAY, FINE PITCH

电源

3 V

认证状态

Not Qualified

最大待机电流

0.000005 A

最大压摆率

0.045 mA

标称供电电压 (Vsup)

3 V

表面贴装

YES

技术

CMOS

温度等级

INDUSTRIAL

端子形式

BALL

端子节距

0.8 mm

端子位置

BOTTOM

参数对比

与AM50DL128CH85IS相近的元器件有：AM50DL128CH、AM50DL128CH70IS、AM50DL128CH56IS、AM50DL128CH56IT、AM50DL128CH70IT、AM50DL128CH85IT。描述及对比如下：

型号	AM50DL128CH85IS	AM50DL128CH	AM50DL128CH70IS	AM50DL128CH56IS	AM50DL128CH56IT	AM50DL128CH70IT	AM50DL128CH85IT
描述	STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM	STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM	STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM	STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM	STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM	STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM	STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
厂商名称	AMD(超微)	-	AMD(超微)	AMD(超微)	-	AMD(超微)	AMD(超微)
包装说明	FBGA, BGA88,10X12,32	-	FBGA, BGA88,10X12,32	FBGA, BGA88,10X12,32	FBGA, BGA88,10X12,32	FBGA, BGA88,10X12,32	FBGA, BGA88,10X12,32
Reach Compliance Code	compli	-	compli	compli	compli	compli	compli
最长访问时间	85 ns	-	70 ns	55 ns	55 ns	70 ns	85 ns
JESD-30 代码	R-PBGA-B88	-	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88
内存集成电路类型	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
混合内存类型	FLASH+PSRAM	-	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM
端子数量	88	-	88	88	88	88	88
最高工作温度	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	FBGA	-	FBGA	FBGA	FBGA	FBGA	FBGA
封装等效代码	BGA88,10X12,32	-	BGA88,10X12,32	BGA88,10X12,32	BGA88,10X12,32	BGA88,10X12,32	BGA88,10X12,32
封装形状	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, FINE PITCH	-	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
电源	3 V	-	3 V	3 V	3 V	3 V	3 V
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大待机电流	0.000005 A	-	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
最大压摆率	0.045 mA	-	0.045 mA	0.045 mA	0.045 mA	0.045 mA	0.045 mA
标称供电电压 (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	-	YES	YES	YES	YES	YES
技术	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	-	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM