型号
- 型号
- 关键词
| 型号 | CD74HC30 | 5962-8974601CA | 8404001CA | CD54HC30F | CD54HC30F3A | CD54HCT30F3A | CD54HC30 | CD54HCT30 | CD74HCT30 |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | CD74HC30 High Speed CMOS Logic 8-Input NAND Gate | High Speed CMOS Logic 8-Input NAND Gate 14-CDIP -55 to 125 | High Speed CMOS Logic 8-Input NAND Gate 14-CDIP -55 to 125 | High Speed CMOS Logic 8-Input NAND Gate 14-CDIP -55 to 125 | High Speed CMOS Logic 8-Input NAND Gate 14-CDIP -55 to 125 | High Speed CMOS Logic 8-Input NAND Gate 14-CDIP -55 to 125 | CD54HC30 High Speed CMOS Logic 8-Input NAND Gate | CD54HCT30 High Speed CMOS Logic 8-Input NAND Gate | CD74HCT30 High Speed CMOS Logic 8-Input NAND Gate |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | - |
| 零件包装代码 | - | DIP | DIP | DIP | DIP | DIP | - | - | - |
| 包装说明 | - | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP-14 | - | - | - |
| 针数 | - | 14 | 14 | 14 | 14 | 14 | - | - | - |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - |
| Factory Lead Time | - | 1 week | 16 weeks | 6 weeks | 16 weeks | 6 weeks | - | - | - |
| 系列 | - | HCT | HC | HC/UH | HC/UH | HCT | - | - | - |
| JESD-30 代码 | - | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - | - | - |
| 长度 | - | 19.56 mm | 19.56 mm | 19.56 mm | 19.56 mm | 19.56 mm | - | - | - |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - | - |
| 逻辑集成电路类型 | - | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | - | - | - |
| 最大I（ol） | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | - | - | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 输入次数 | - | 8 | 8 | 8 | 8 | 8 | - | - | - |
| 端子数量 | - | 14 | 14 | 14 | 14 | 14 | - | - | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | - |
| 封装代码 | - | DIP | DIP | DIP | DIP | DIP | - | - | - |
| 封装等效代码 | - | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | - | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | - | - |
| 包装方法 | - | TUBE | TUBE | TUBE | TUBE | TUBE | - | - | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 电源 | - | 5 V | 2/6 V | 2/6 V | 2/6 V | 5 V | - | - | - |
| 最大电源电流（ICC） | - | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | - | - | - |
| Prop。Delay @ Nom-Sup | - | 42 ns | 30 ns | 39 ns | 39 ns | 42 ns | - | - | - |
| 传播延迟（tpd） | - | 42 ns | 195 ns | 195 ns | 195 ns | 42 ns | - | - | - |
| 认证状态 | - | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
| 施密特触发器 | - | NO | NO | NO | NO | NO | - | - | - |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - | - | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 6 V | 6 V | 6 V | 5.5 V | - | - | - |
| 最小供电电压 (Vsup) | - | 4.5 V | 2 V | 2 V | 2 V | 4.5 V | - | - | - |
| 标称供电电压 (Vsup) | - | 5 V | 4.5 V | 4.5 V | 4.5 V | 5 V | - | - | - |
| 表面贴装 | - | NO | NO | NO | NO | NO | - | - | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | - | - |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - | - |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 宽度 | - | 6.67 mm | 7.62 mm | 7.62 mm | 7.62 mm | 6.67 mm | - | - | - |
