型号
- 型号
- 关键词
32-BIT, 200 MHz, RISC PROCESSOR, PBGA256
32位, 200 MHz, RISC处理器, PBGA256
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：Renesas(瑞萨电子)
下载文档| 型号 | HD6417751RF200 | HD6417751BP167 | HD6417751 | HD6417751F167 | HD6417751RF240 | HD6417751RBP240 | HD6417751VF133 |
|---|---|---|---|---|---|---|---|
| 描述 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 240 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 |
| 地址总线宽度 | 26 | 26 | 26 | 26 | 26 | 26 | 26 |
| 边界扫描 | YES | YES | Yes | YES | YES | YES | YES |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 集成缓存 | YES | YES | Yes | YES | YES | YES | YES |
| 端子数量 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| 表面贴装 | YES | YES | Yes | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | GULL WING | BALL | BALL | GULL WING | GULL WING | BALL | GULL WING |
| 端子位置 | QUAD | BOTTOM | BOTTOM | QUAD | QUAD | BOTTOM | QUAD |
| 是否Rohs认证 | 不符合 | 符合 | - | - | 不符合 | 不符合 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | QFP | BGA | - | HFQFP | QFP | BGA | QFP |
| 包装说明 | FQFP, | BGA, BGA256,20X20,50 | - | QFP-256 | QFP-256 | BGA, | FQFP, QFP256,1.2SQ,16 |
| 针数 | 256 | 256 | - | 256 | 256 | 256 | 256 |
| Reach Compliance Code | compli | unknow | - | compli | compli | compli | unknow |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | - | 3A991.A.2 | 3A991.A.2 | 3A991 | 3A991.A.2 |
| 位大小 | 32 | 32 | - | 32 | 32 | 32 | 32 |
| 最大时钟频率 | 34 MHz | 34 MHz | - | 34 MHz | 34 MHz | 34 MHz | 34 MHz |
| 格式 | FLOATING POINT | FLOATING POINT | - | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| JESD-30 代码 | S-PQFP-G256 | S-PBGA-B256 | - | S-PQFP-G256 | S-PQFP-G256 | S-PBGA-B256 | S-PQFP-G256 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 | e6 |
| 长度 | 28 mm | 27 mm | - | 28 mm | 28 mm | 27 mm | 28 mm |
| 低功率模式 | YES | YES | - | YES | YES | YES | YES |
| 最高工作温度 | 75 °C | 75 °C | - | 75 °C | 75 °C | 75 °C | 75 °C |
| 最低工作温度 | -20 °C | -20 °C | - | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FQFP | BGA | - | FQFP | FQFP | BGA | FQFP |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH | GRID ARRAY | - | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.95 mm | 2.1 mm | - | 3.95 mm | 3.95 mm | 2.1 mm | 3.95 mm |
| 速度 | 200 MHz | 167 MHz | - | 167 MHz | 240 MHz | 240 MHz | 133 MHz |
| 最大供电电压 | 1.6 V | 2 V | - | 2 V | 1.6 V | 1.6 V | 1.6 V |
| 最小供电电压 | 1.35 V | 1.6 V | - | 1.6 V | 1.4 V | 1.4 V | 1.4 V |
| 标称供电电压 | 1.5 V | 1.8 V | - | 1.8 V | 1.5 V | 1.5 V | 1.5 V |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | TIN LEAD | - | - | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Bismuth (Sn/Bi) |
| 端子节距 | 0.4 mm | 1.27 mm | - | 0.4 mm | 0.4 mm | 1.27 mm | 0.4 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 28 mm | 27 mm | - | 28 mm | 28 mm | 27 mm | 28 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |