型号 | HD6417751 | HD6417751BP167 | HD6417751F167 | HD6417751RF200 | HD6417751RF240 | HD6417751RBP240 | HD6417751VF133 |
---|---|---|---|---|---|---|---|
描述 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 240 MHz, RISC PROCESSOR, PBGA256 | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA256 |
端子数量 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
表面贴装 | Yes | YES | YES | YES | YES | YES | YES |
端子形式 | BALL | BALL | GULL WING | GULL WING | GULL WING | BALL | GULL WING |
端子位置 | BOTTOM | BOTTOM | QUAD | QUAD | QUAD | BOTTOM | QUAD |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
地址总线宽度 | 26 | 26 | 26 | 26 | 26 | 26 | 26 |
边界扫描 | Yes | YES | YES | YES | YES | YES | YES |
集成缓存 | Yes | YES | YES | YES | YES | YES | YES |
是否Rohs认证 | - | 符合 | - | 不符合 | 不符合 | 不符合 | 符合 |
零件包装代码 | - | BGA | HFQFP | QFP | QFP | BGA | QFP |
包装说明 | - | BGA, BGA256,20X20,50 | QFP-256 | FQFP, | QFP-256 | BGA, | FQFP, QFP256,1.2SQ,16 |
针数 | - | 256 | 256 | 256 | 256 | 256 | 256 |
Reach Compliance Code | - | unknow | compli | compli | compli | compli | unknow |
ECCN代码 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991 | 3A991.A.2 |
位大小 | - | 32 | 32 | 32 | 32 | 32 | 32 |
最大时钟频率 | - | 34 MHz | 34 MHz | 34 MHz | 34 MHz | 34 MHz | 34 MHz |
格式 | - | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
JESD-30 代码 | - | S-PBGA-B256 | S-PQFP-G256 | S-PQFP-G256 | S-PQFP-G256 | S-PBGA-B256 | S-PQFP-G256 |
长度 | - | 27 mm | 28 mm | 28 mm | 28 mm | 27 mm | 28 mm |
低功率模式 | - | YES | YES | YES | YES | YES | YES |
最高工作温度 | - | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
最低工作温度 | - | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | BGA | FQFP | FQFP | FQFP | BGA | FQFP |
封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | GRID ARRAY | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY | FLATPACK, FINE PITCH |
峰值回流温度(摄氏度) | - | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2.1 mm | 3.95 mm | 3.95 mm | 3.95 mm | 2.1 mm | 3.95 mm |
速度 | - | 167 MHz | 167 MHz | 200 MHz | 240 MHz | 240 MHz | 133 MHz |
最大供电电压 | - | 2 V | 2 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
最小供电电压 | - | 1.6 V | 1.6 V | 1.35 V | 1.4 V | 1.4 V | 1.4 V |
标称供电电压 | - | 1.8 V | 1.8 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子节距 | - | 1.27 mm | 0.4 mm | 0.4 mm | 0.4 mm | 1.27 mm | 0.4 mm |
处于峰值回流温度下的最长时间 | - | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 27 mm | 28 mm | 28 mm | 28 mm | 27 mm | 28 mm |
uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
厂商名称 | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
JESD-609代码 | - | - | e0 | e0 | e0 | e0 | e6 |
端子面层 | - | - | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Bismuth (Sn/Bi) |