型号
- 型号
- 关键词
Flash, 64MX16, 76ns, PBGA63, FBGA-63
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
器件标准：
| 型号 | KFG1G16U2C-DIB60 | KFG1G16U2C-AIB60 | KFG1G16U2C-AIB6T | KFG1G16U2C-DIB6T |
|---|---|---|---|---|
| 描述 | Flash, 64MX16, 76ns, PBGA63, FBGA-63 | Flash, 64MX16, 76ns, PBGA63, FBGA-63 | EEPROM Card, 64MX16, 70ns, Parallel, CMOS, PBGA63 | EEPROM Card, 64MX16, 70ns, Parallel, CMOS, PBGA63 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | VFBGA, BGA63,10X12,32 | VFBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| 最长访问时间 | 76 ns | 76 ns | 70 ns | 70 ns |
| 命令用户界面 | YES | YES | YES | YES |
| 数据轮询 | NO | NO | NO | NO |
| JESD-30 代码 | R-PBGA-B63 | R-PBGA-B63 | R-PBGA-B63 | R-PBGA-B63 |
| 内存密度 | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit |
| 内存集成电路类型 | FLASH | FLASH | EEPROM CARD | EEPROM CARD |
| 内存宽度 | 16 | 16 | 16 | 16 |
| 部门数/规模 | 1K | 1K | 1K | 1K |
| 端子数量 | 63 | 63 | 63 | 63 |
| 字数 | 67108864 words | 67108864 words | 67108864 words | 67108864 words |
| 字数代码 | 64000000 | 64000000 | 64000000 | 64000000 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 64MX16 | 64MX16 | 64MX16 | 64MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | VFBGA | FBGA | FBGA |
| 封装等效代码 | BGA63,10X12,32 | BGA63,10X12,32 | BGA63,10X12,32 | BGA63,10X12,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 页面大小 | 1K words | 1K words | 1K words | 1K words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 225 |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 编程电压 | 3.3 V | 3.3 V | 2.7 V | 2.7 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | YES | YES | YES |
| 部门规模 | 64K | 64K | 64K | 64K |
| 最大待机电流 | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A |
| 最大压摆率 | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 切换位 | NO | NO | NO | NO |
| 类型 | SLC NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE |
| JESD-609代码 | - | e1 | e1 | e3 |
| 湿度敏感等级 | - | 3 | 3 | 1 |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | MATTE TIN |
| Base Number Matches | - | 1 | 1 | 1 |