型号
- 型号
- 关键词
IC,FREQUENCY SYNTHESIZER,CMOS,DIP,18PIN,CERAMIC
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | MC145145L1 | MC145145P1DS | MC145145LDS | MC145145P1 | MC145145LD |
|---|---|---|---|---|---|
| 描述 | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,18PIN,CERAMIC | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,18PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,18PIN,CERAMIC | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,18PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,18PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T18 | R-PDIP-T18 | R-XDIP-T18 | R-PDIP-T18 | R-XDIP-T18 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |