文档解析

微控制器中的A/D转换器（模数转换器）是将模拟信号转换为数字信号的关键组件，它们在各种应用中都有广泛的使用。这些微控制器具备两种类型的A/D转换器：RC振荡型和逐次逼近型。以下是它们各自的优势和局限性：

RC振荡型A/D转换器

优势：

成本效益： 通常来说，RC振荡型A/D转换器的硬件实现成本较低。
简单易用： 它们易于实现，不需要外部时钟，使用内部RC振荡器即可。
适用于低频信号： 适合测量变化不是非常快的模拟信号，如温度传感器、压力传感器等。

局限性：

精度有限： 相比于逐次逼近型A/D转换器，RC振荡型转换器的精度通常较低。
温度依赖性： 它们的性能可能会受到温度变化的影响，需要校准。
速度较慢： 转换速度较慢，不适合高速或实时应用。

逐次逼近型A/D转换器

优势：

高精度： 逐次逼近型A/D转换器可以提供较高的分辨率，例如12位精度。
可编程参考电压： 允许使用外部或内部参考电压，增加了灵活性。
较快的转换速度： 相比于RC振荡型，逐次逼近型转换器通常具有更快的转换速度。

局限性：

成本较高： 逐次逼近型A/D转换器的硬件实现成本通常高于RC振荡型。
复杂性： 设计和调试可能更复杂，需要精确的时钟管理。
功耗较高： 高精度和快速转换速度可能会增加功耗。

通用局限性

有限的输入通道： 微控制器的A/D转换器通常有固定的输入通道数量，这可能限制了同时测量多个模拟信号的能力。
采样率限制： 微控制器的A/D转换器可能无法达到高速模拟信号的采样要求。
数字输出处理： 转换后的数字信号需要通过微控制器的CPU进行处理，这可能会增加CPU的负载。

在选择微控制器时，需要根据具体的应用需求来权衡这些优势和局限性，以确保选用的A/D转换器能够满足性能、成本和功耗等方面的要求。

文档预览

FEDL610Q431-02

Issue Date: Feb.8, 2011

ML610Q431/ML610Q432

8-bit Microcontroller with a Built-in LCD driver

GENERAL DESCRIPTION

This LSI is a high-performance 8-bit CMOS microcontroller into which rich peripheral circuits, such as real-time clock,

synchronous serial port, UART, I

C bus interface (master), melody driver, battery level detect circuit, RC oscillation type A/D

converter, 12-bit successive approximation type A/D converter, and LCD driver, are incorporated around 8-bit CPU nX-U8/100.

The CPU nX-U8/100 is capable of efficient instruction execution in 1-intruction 1-clock mode by 3-stage pipe line architecture

parallel procesing. The Flash ROM that is installed as program memory achieves low-voltage low-power consumption operation

(read operation) equivalent to mask ROM and is most suitable for battery-driven applications.

The on-chip debug function that is installed enables program debugging and programming.

FEATURES



CPU



8-bit RISC CPU (CPU name: nX-U8/100)



Instruction system: 16-bit instructions



Instruction set:

Transfer, arithmetic operations, comparison, logic operations, multiplication/division, bit

manipulations, bit logic operations, jump, conditional jump, call return stack manipulations, arithmetic

shift, and so on



On-Chip debug function



Minimum instruction execution time

30.5

s

(@32.768 kHz system clock)

0.24 4s (@4.096 MHz system clock)



Internal memory



Internal 64KBbyte Flash ROM (32K16 bits) (including unusable 1KByte TEST area)



Internal 2KByte Data RAM (20488 bits), 1KByte Display Allocation RAM (1024 x 8bit)



Internal 192Byte RAM for display



Interrupt controller



2 non-maskable interrupt sources (Internal source: 1, External source: 1)



23 maskable interrupt sources (Internal sources: 19, External sources: 4)



Time base counter



Low-speed time base counter

1

channel

Frequency compensation (Compensation range: Approx.

488ppm

to +488ppm. Compensation accuracy: Approx.

0.48ppm)



High-speed time base counter

1

channel



Watchdog timer



Non-maskable interrupt and reset



Free running



Overflow period: 4 types selectable (125ms, 500ms, 2s, and 8s)



Timers



8 bits



4 channels (16-bit configuration available)



1 kHz timer



10 Hz/1 Hz interrupt function

1/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432



Capture



Time base capture



2 channels (4096 Hz to 32 Hz)



PWM



Resolution 16 bits



1 channel



Real time clock



Year, month, day, day of the week, hour, minute, and second registers



Automatic leap year correction



Regular interrupts (0.5 sec, 1 sec, 1 minute, 1 hour)



Alarm interrupt



2 channels (day of the week, hour, minute; month, day hour, minute)



Synchronous serial port



Master/slave selectable



LSB first/MSB first selectable



8-bit length/16-bit length selectable



UART



TXD/RXD



1 channel



Bit length, parity/no parity, odd parity/even parity, 1 stop bit/2 stop bits



Positive logic/negative logic selectable



Built-in baud rate generator



C bus interface



Master function only



Fast mode (400 kbps@4MH½), standard mode (100 kbps@1MH½, 50kbps@500kHz)



Melody driver



Scale: 29 types (Melody sound frequency: 508 Hz to 32.768 kHz)



Tone length: 63 types



Tempo: 15 types



Buzzer output mode (4 output modes, 8 frequencies, 16 duty levels)



RC oscillation type A/D converter



24-bit counter



Time division



2 channels



Successive approximation type A/D converter



12-bit A/D converter



Input



2 channels



General-purpose ports



Non-maskable interrupt input port



1 channel



Input-only port



6 channels (including secondary functions)



Output-only port



3 channels (including secondary functions)



Input/output port

ML610Q431: 22 channels (including secondary functions)

ML610Q432: 14 channels (including secondary functions)

2/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432



LCD driver



Dot matrix can be supported.

ML610Q431: 1024 dots max. (64 seg



16 com)

ML610Q432: 1536 dots max. (64 seg



24 com)



1/1 to 1/24 duty



1/3 or 1/4 bias (built-in bias generation circuit)



Frame frequency selecable (approx. 64 Hz, 73 Hz, 85 Hz, and 102 Hz)



Bias voltage multiplying clock selectable (8 types)



Contrast adjustment (1/3 bias: 32 steps, 1/4 bias: 20 steps)



LCD drive stop mode, LCD display mode, all LCDs on mode, and all LCDs off mode selectable



Programmable display allocation function (available only when 1/1~1/8 duty is selected)



Reset



Reset through the RESET_N pin



Power-on reset generation when powered on



Reset when oscillation stop of the low-speed clock is detected



(“A”version(ML610Q431A/Q432A) don’t have the oscilation stop function.)



Reset by the watchdog timer (WDT) overflow



Power supply voltage detect function



Judgment voltages:

One of 16 levels



Judgment accuracy:

2%

(Typ.)



Clock



Low-speed clock: (This LSI can not guarantee the operation withoug low-speed clock)

Crystal oscillation (32.768 kHz)



High-speed clock:

Built-in RC oscillation (500 kHz)

Built-in PLL oscillation (8.192 MHz

2.5%),

crystal/ceramic oscillation (4.096 MHz), external clock



Selection of high-speed clock mode by software:

Built-in RC oscillation, built-in PLL oscillation, crystal/ceramic oscillation, external clock



Power management



HALT mode: Instruction execution by CPU is suspended (peripheral circuits are in operating states).



STOP mode: Stop of low-speed oscillation and high-speed oscillation (Operations of CPU and peripheral circuits are

stopped.)



Clock gear: The frequency of high-speed system clock can be changed by software (1/1, 1/2, 1/4, or 1/8 of the oscillation

clock)



Block Control Function: Power down (reset registers and stop clock supply) the circuits of unused peripherals.



Shipment



Chip

ML610Q431-xxxWA (Blank product: ML610Q431-NNNWA)

ML610Q432-xxxWA (Blank product: ML610Q432-NNNWA)

ML610Q431A-xxxWA (Blank product: ML610Q431A-NNNWA)

ML610Q432A-xxxWA (Blank product: ML610Q432A-NNNWA)



144-pin plastic LQFP

ML610Q431-xxxTCZ03A (Blank product: ML610Q431-NNNTCZ03A)

ML610Q432-xxxTCZ03A (Blank product: ML610Q432-NNNTCZ03A)

ML610Q431A-xxxTCZ03A (Blank product: ML610Q431A-NNNTCZ03A)

ML610Q432A-xxxTCZ03A (Blank product: ML610Q432A-NNNTCZ03A)

xxx: ROM code number



Guaranteed operating range



Operating temperature:

20C

to 70C



Operating voltage: V

= 1.1V to 3.6V, AV

= 2.2V to 3.6V

3/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432

BLOCK DIAGRAM

ML610Q431 Block Diagram

Figure 1 show the block diagram of the ML610Q431.

"*" indicates the secondary function of each port.

CPU (nX-U8/100)

EPSW1½3

PSW

Timing

Controller

GREG

0½15

ALU

Instruction

Decoder

ELR1½3

Instruction

Data-bus

RAM

2048byte

Interrupt

Controller

INT

Power

INT

UART

INT

TBC

INT

PWM

1kHzTC

INT

PWM0*

SDA*

SCL*

RXD0*

TXD0*

BUS

Controller

ECSR1½3

DSR/CSR

Program

Memory

(Flash)

64Kbyte

On-Chip

ICE

RESET_N

TEST

XT0

XT1

OSC0*

OSC1*

LSCLK*

OUTCLK*

DDL

DDX

OSC

RESET &

TEST

INT

SSIO

SCK0*

SIN0*

SOUT0*

WDT

IN0*

CS0*

RS0*

RT0*

RCT0*

RCM*

IN1*

CS1*

RS1*

RT1*

REF

AIN0, AIN1

RC-ADC

×2

Capture

×2

INT

8bit Timer

×4

Melody

MD0*

NMI

P00 to P03

P10 to P11

GPIO

P20 to P22

P30 to P35

P40 to P47

PA0 to PA7

COM0 to COM15

SEG0 to SEG63

, V

C1, C2, C3, C4

INT

12bit-ADC

RTC

Display Allocation

RAM 1024Byte

Display RAM

192Byte

LCD

Driver

BLD

LCD

BIAS

Figure 1 ML610Q431 Block Diagram

4/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432

ML610Q432 Block Diagram

Figure 2 show the block diagram of the ML610Q432.

"*" indicates the secondary function of each port.

CPU (nX-U8/100)

EPSW1½3

PSW

Timing

Controller

GREG

0½15

ALU

Instruction

Decoder

ELR1½3

Instruction

Data-bus

RAM

2048byte

Interrupt

Controller

INT

Power

INT

UART

INT

TBC

INT

PWM

1kHzTC

INT

PWM0*

SDA*

SCL*

RXD0*

TXD0*

BUS

Controller

ECSR1½3

DSR/CSR

Program

Memory

(Flash)

64Kbyte

On-Chip

ICE

RESET_N

TEST

XT0

XT1

OSC0*

OSC1*

LSCLK*

OUTCLK*

DDL

DDX

OSC

RESET &

TEST

INT

SSIO

SCK0*

SIN0*

SOUT0*

WDT

IN0*

CS0*

RS0*

RT0*

RCT0*

RCM*

IN1*

CS1*

RS1*

RT1*

REF

AIN0, AIN1

RC-ADC

×2

Capture

×2

INT

8bit Timer

×4

Melody

MD0*

NMI

P00 to P03

P10 to P11

GPIO

P20 to P22

P30 to P35

P40 to P47

INT

12bit-ADC

RTC

Display Allocation

RAM 1024Byte

Display RAM

192Byte

LCD

Driver

COM0 to COM23

SEG0 to SEG63

, V

C1, C2, C3, C4

BLD

LCD

BIAS

Figure 2 ML610Q432 Block Diagram

5/35

参数对比

与ML610Q431-NNNTCZ03A相近的元器件有：ML610Q431-XXXWA、ML610Q432-XXXWA、ML610Q432-NNNWA、ML610Q432-XXXTCZ03A。描述及对比如下：

型号	ML610Q431-NNNTCZ03A	ML610Q431-XXXWA	ML610Q432-XXXWA	ML610Q432-NNNWA	ML610Q432-XXXTCZ03A
描述	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
是否Rohs认证	符合	符合	符合	符合	符合
零件包装代码	QFP	DIE	DIE	DIE	QFP
包装说明	20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144	CHIP-136	CHIP-136	CHIP-136	20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
针数	144	136	136	136	144
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
具有ADC	YES	YES	YES	YES	YES
其他特性	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ
位大小	8	8	8	8	8
最大时钟频率	4.096 MHz	4.096 MHz	4.096 MHz	4.096 MHz	4.096 MHz
DAC 通道	NO	NO	NO	NO	NO
DMA 通道	NO	NO	NO	NO	NO
JESD-30 代码	S-PQFP-G144	R-XUUC-N136	R-XUUC-N136	R-XUUC-N136	S-PQFP-G144
长度	20 mm	4.23 mm	4.23 mm	4.23 mm	20 mm
I/O 线路数量	31	31	23	23	23
端子数量	144	136	136	136	144
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C
最低工作温度	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
PWM 通道	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
封装代码	LFQFP	DIE	DIE	DIE	LFQFP
封装形状	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	FLATPACK, LOW PROFILE, FINE PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH
速度	4.2 MHz	4.2 MHz	4.2 MHz	4.2 MHz	4.2 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
标称供电电压	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	GULL WING	NO LEAD	NO LEAD	NO LEAD	GULL WING
端子位置	QUAD	UPPER	UPPER	UPPER	QUAD
宽度	20 mm	3.33 mm	3.33 mm	3.33 mm	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	1	1	1	-	-