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ML610Q432-XXXWA

描述:
RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136
分类:
文件大小:
631KB,共35页
制造商:
标准:
概述
RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136
器件参数
参数名称
属性值
是否Rohs认证
符合
零件包装代码
DIE
包装说明
CHIP-136
针数
136
Reach Compliance Code
unknown
具有ADC
YES
其他特性
OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ
地址总线宽度
位大小
8
最大时钟频率
4.096 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
R-XUUC-N136
长度
4.23 mm
I/O 线路数量
23
端子数量
136
最高工作温度
70 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
UNSPECIFIED
封装代码
DIE
封装形状
RECTANGULAR
封装形式
UNCASED CHIP
认证状态
Not Qualified
ROM可编程性
FLASH
速度
4.2 MHz
最大供电电压
3.6 V
最小供电电压
1.8 V
标称供电电压
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
NO LEAD
端子位置
UPPER
宽度
3.33 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
Base Number Matches
1
文档解析

ML610Q431和ML610Q432是LAPIS Semiconductor公司生产的8位微控制器,它们具有许多共同的特性,如内置LCD驱动器、多种通信接口、定时器、A/D转换器等。不过,根据文件内容,这两个型号在一些性能参数上存在差异:

  1. LCD驱动能力

    • ML610Q431支持最大1024点的点阵(64段x 16 commons)。
    • ML610Q432支持最大1536点的点阵(64段x 24 commons),这意味着ML610Q432在LCD显示方面提供了更多的灵活性和更高的分辨率。
  2. GPIO(通用输入输出端口)数量

    • ML610Q431拥有更多的GPIO端口,共有22个通道(包括次要功能)。
    • ML610Q432则有14个通道(包括次要功能),这可能影响到它们在不同应用中的适用性和扩展性。
  3. 封装类型

    • 文件中提到了ML610Q431和ML610Q432的封装类型,均为144-pin塑料LQFP封装,但具体的封装尺寸和PAD布局可能有所不同,这可能会影响它们在不同应用中的物理适应性。
  4. 其他特性

    • 尽管文件中没有明确列出其他性能差异,但通常不同的型号可能会在时钟频率、功耗、内存大小等方面有所不同。这些差异需要通过详细规格书或数据手册进行比较。

为了获得更详细的差异信息,建议查阅每个型号的完整数据手册,以对比它们的技术规格和性能指标。如果需要进一步的比较或有特定的性能需求,可以提供更具体的问题。

文档预览
FEDL610Q431-02
Issue Date: Feb.8, 2011
ML610Q431/ML610Q432
8-bit Microcontroller with a Built-in LCD driver
GENERAL DESCRIPTION
This LSI is a high-performance 8-bit CMOS microcontroller into which rich peripheral circuits, such as real-time clock,
synchronous serial port, UART, I
2
C bus interface (master), melody driver, battery level detect circuit, RC oscillation type A/D
converter, 12-bit successive approximation type A/D converter, and LCD driver, are incorporated around 8-bit CPU nX-U8/100.
The CPU nX-U8/100 is capable of efficient instruction execution in 1-intruction 1-clock mode by 3-stage pipe line architecture
parallel procesing. The Flash ROM that is installed as program memory achieves low-voltage low-power consumption operation
(read operation) equivalent to mask ROM and is most suitable for battery-driven applications.
The on-chip debug function that is installed enables program debugging and programming.
FEATURES
CPU
8-bit RISC CPU (CPU name: nX-U8/100)
Instruction system: 16-bit instructions
Instruction set:
Transfer, arithmetic operations, comparison, logic operations, multiplication/division, bit
manipulations, bit logic operations, jump, conditional jump, call return stack manipulations, arithmetic
shift, and so on
On-Chip debug function
Minimum instruction execution time
30.5
s
(@32.768 kHz system clock)
0.24 4s (@4.096 MHz system clock)
Internal memory
Internal 64KBbyte Flash ROM (32K16 bits) (including unusable 1KByte TEST area)
Internal 2KByte Data RAM (20488 bits), 1KByte Display Allocation RAM (1024 x 8bit)
Internal 192Byte RAM for display
Interrupt controller
2 non-maskable interrupt sources (Internal source: 1, External source: 1)
23 maskable interrupt sources (Internal sources: 19, External sources: 4)
Time base counter
Low-speed time base counter
1
channel
Frequency compensation (Compensation range: Approx.
488ppm
to +488ppm. Compensation accuracy: Approx.
0.48ppm)
High-speed time base counter
1
channel
Watchdog timer
Non-maskable interrupt and reset
Free running
Overflow period: 4 types selectable (125ms, 500ms, 2s, and 8s)
Timers
8 bits
4 channels (16-bit configuration available)
1 kHz timer
10 Hz/1 Hz interrupt function
1/35
FEDL610Q431-02
LAPIS Semiconductor
ML610Q431/ML610Q432
Capture
Time base capture
2 channels (4096 Hz to 32 Hz)
PWM
Resolution 16 bits
1 channel
Real time clock
Year, month, day, day of the week, hour, minute, and second registers
Automatic leap year correction
Regular interrupts (0.5 sec, 1 sec, 1 minute, 1 hour)
Alarm interrupt
2 channels (day of the week, hour, minute; month, day hour, minute)
Synchronous serial port
Master/slave selectable
LSB first/MSB first selectable
8-bit length/16-bit length selectable
UART
TXD/RXD
1 channel
Bit length, parity/no parity, odd parity/even parity, 1 stop bit/2 stop bits
Positive logic/negative logic selectable
Built-in baud rate generator
I
2
C bus interface
Master function only
Fast mode (400 kbps@4MH½), standard mode (100 kbps@1MH½, 50kbps@500kHz)
Melody driver
Scale: 29 types (Melody sound frequency: 508 Hz to 32.768 kHz)
Tone length: 63 types
Tempo: 15 types
Buzzer output mode (4 output modes, 8 frequencies, 16 duty levels)
RC oscillation type A/D converter
24-bit counter
Time division
2 channels
Successive approximation type A/D converter
12-bit A/D converter
Input
2 channels
General-purpose ports
Non-maskable interrupt input port
1 channel
Input-only port
6 channels (including secondary functions)
Output-only port
3 channels (including secondary functions)
Input/output port
ML610Q431: 22 channels (including secondary functions)
ML610Q432: 14 channels (including secondary functions)
2/35
FEDL610Q431-02
LAPIS Semiconductor
ML610Q431/ML610Q432
LCD driver
Dot matrix can be supported.
ML610Q431: 1024 dots max. (64 seg
16 com)
ML610Q432: 1536 dots max. (64 seg
24 com)
1/1 to 1/24 duty
1/3 or 1/4 bias (built-in bias generation circuit)
Frame frequency selecable (approx. 64 Hz, 73 Hz, 85 Hz, and 102 Hz)
Bias voltage multiplying clock selectable (8 types)
Contrast adjustment (1/3 bias: 32 steps, 1/4 bias: 20 steps)
LCD drive stop mode, LCD display mode, all LCDs on mode, and all LCDs off mode selectable
Programmable display allocation function (available only when 1/1~1/8 duty is selected)
Reset
Reset through the RESET_N pin
Power-on reset generation when powered on
Reset when oscillation stop of the low-speed clock is detected
(“A”version(ML610Q431A/Q432A) don’t have the oscilation stop function.)
Reset by the watchdog timer (WDT) overflow
Power supply voltage detect function
Judgment voltages:
One of 16 levels
Judgment accuracy:
2%
(Typ.)
Clock
Low-speed clock: (This LSI can not guarantee the operation withoug low-speed clock)
Crystal oscillation (32.768 kHz)
High-speed clock:
Built-in RC oscillation (500 kHz)
Built-in PLL oscillation (8.192 MHz
2.5%),
crystal/ceramic oscillation (4.096 MHz), external clock
Selection of high-speed clock mode by software:
Built-in RC oscillation, built-in PLL oscillation, crystal/ceramic oscillation, external clock
Power management
HALT mode: Instruction execution by CPU is suspended (peripheral circuits are in operating states).
STOP mode: Stop of low-speed oscillation and high-speed oscillation (Operations of CPU and peripheral circuits are
stopped.)
Clock gear: The frequency of high-speed system clock can be changed by software (1/1, 1/2, 1/4, or 1/8 of the oscillation
clock)
Block Control Function: Power down (reset registers and stop clock supply) the circuits of unused peripherals.
Shipment
Chip
ML610Q431-xxxWA (Blank product: ML610Q431-NNNWA)
ML610Q432-xxxWA (Blank product: ML610Q432-NNNWA)
ML610Q431A-xxxWA (Blank product: ML610Q431A-NNNWA)
ML610Q432A-xxxWA (Blank product: ML610Q432A-NNNWA)
144-pin plastic LQFP
ML610Q431-xxxTCZ03A (Blank product: ML610Q431-NNNTCZ03A)
ML610Q432-xxxTCZ03A (Blank product: ML610Q432-NNNTCZ03A)
ML610Q431A-xxxTCZ03A (Blank product: ML610Q431A-NNNTCZ03A)
ML610Q432A-xxxTCZ03A (Blank product: ML610Q432A-NNNTCZ03A)
xxx: ROM code number
Guaranteed operating range
Operating temperature:
20C
to 70C
Operating voltage: V
DD
= 1.1V to 3.6V, AV
DD
= 2.2V to 3.6V
3/35
FEDL610Q431-02
LAPIS Semiconductor
ML610Q431/ML610Q432
BLOCK DIAGRAM
ML610Q431 Block Diagram
Figure 1 show the block diagram of the ML610Q431.
"*" indicates the secondary function of each port.
CPU (nX-U8/100)
EPSW1½3
PSW
Timing
Controller
GREG
0½15
ALU
Instruction
Decoder
ELR1½3
LR
EA
SP
Instruction
Register
Data-bus
RAM
2048byte
Interrupt
Controller
INT
1
INT
4
Power
INT
1
INT
1
INT
1
UART
INT
1
I
2
C
TBC
INT
1
PWM
1kHzTC
INT
1
INT
5
PWM0*
SDA*
SCL*
RXD0*
TXD0*
BUS
Controller
ECSR1½3
DSR/CSR
PC
Program
Memory
(Flash)
64Kbyte
V
PP
On-Chip
ICE
V
DD
V
SS
RESET_N
TEST
XT0
XT1
OSC0*
OSC1*
LSCLK*
OUTCLK*
V
DDL
V
DDX
OSC
RESET &
TEST
INT
1
SSIO
SCK0*
SIN0*
SOUT0*
WDT
IN0*
CS0*
RS0*
RT0*
RCT0*
RCM*
IN1*
CS1*
RS1*
RT1*
AV
DD
AV
SS
V
REF
AIN0, AIN1
RC-ADC
×2
Capture
×2
INT
4
INT
3
8bit Timer
×4
Melody
MD0*
NMI
P00 to P03
P10 to P11
GPIO
P20 to P22
P30 to P35
P40 to P47
PA0 to PA7
COM0 to COM15
SEG0 to SEG63
V
L1
, V
L2
, V
L3
, V
L4
C1, C2, C3, C4
INT
1
12bit-ADC
RTC
Display Allocation
RAM 1024Byte
Display RAM
192Byte
LCD
Driver
BLD
LCD
BIAS
Figure 1 ML610Q431 Block Diagram
4/35
FEDL610Q431-02
LAPIS Semiconductor
ML610Q431/ML610Q432
ML610Q432 Block Diagram
Figure 2 show the block diagram of the ML610Q432.
"*" indicates the secondary function of each port.
CPU (nX-U8/100)
EPSW1½3
PSW
Timing
Controller
GREG
0½15
ALU
Instruction
Decoder
ELR1½3
LR
EA
SP
Instruction
Register
Data-bus
RAM
2048byte
Interrupt
Controller
INT
1
INT
4
Power
INT
1
INT
1
INT
1
UART
INT
1
I
2
C
TBC
INT
1
PWM
1kHzTC
INT
1
INT
5
PWM0*
SDA*
SCL*
RXD0*
TXD0*
BUS
Controller
ECSR1½3
DSR/CSR
PC
Program
Memory
(Flash)
64Kbyte
V
PP
On-Chip
ICE
V
DD
V
SS
RESET_N
TEST
XT0
XT1
OSC0*
OSC1*
LSCLK*
OUTCLK*
V
DDL
V
DDX
OSC
RESET &
TEST
INT
1
SSIO
SCK0*
SIN0*
SOUT0*
WDT
IN0*
CS0*
RS0*
RT0*
RCT0*
RCM*
IN1*
CS1*
RS1*
RT1*
AV
DD
AV
SS
V
REF
AIN0, AIN1
RC-ADC
×2
Capture
×2
INT
4
INT
3
8bit Timer
×4
Melody
MD0*
NMI
P00 to P03
P10 to P11
GPIO
P20 to P22
P30 to P35
P40 to P47
INT
1
12bit-ADC
RTC
Display Allocation
RAM 1024Byte
Display RAM
192Byte
LCD
Driver
COM0 to COM23
SEG0 to SEG63
V
L1
, V
L2
, V
L3
, V
L4
C1, C2, C3, C4
BLD
LCD
BIAS
Figure 2 ML610Q432 Block Diagram
5/35
参数对比
与ML610Q432-XXXWA相近的元器件有:ML610Q431-XXXWA、ML610Q431-NNNTCZ03A、ML610Q432-NNNWA、ML610Q432-XXXTCZ03A。描述及对比如下:
型号 ML610Q432-XXXWA ML610Q431-XXXWA ML610Q431-NNNTCZ03A ML610Q432-NNNWA ML610Q432-XXXTCZ03A
描述 RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136 RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136 RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144 RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136 RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
是否Rohs认证 符合 符合 符合 符合 符合
零件包装代码 DIE DIE QFP DIE QFP
包装说明 CHIP-136 CHIP-136 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144 CHIP-136 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
针数 136 136 144 136 144
Reach Compliance Code unknown unknown unknown unknown unknow
具有ADC YES YES YES YES YES
其他特性 OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ
位大小 8 8 8 8 8
最大时钟频率 4.096 MHz 4.096 MHz 4.096 MHz 4.096 MHz 4.096 MHz
DAC 通道 NO NO NO NO NO
DMA 通道 NO NO NO NO NO
JESD-30 代码 R-XUUC-N136 R-XUUC-N136 S-PQFP-G144 R-XUUC-N136 S-PQFP-G144
长度 4.23 mm 4.23 mm 20 mm 4.23 mm 20 mm
I/O 线路数量 23 31 31 23 23
端子数量 136 136 144 136 144
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C -20 °C
PWM 通道 YES YES YES YES YES
封装主体材料 UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
封装代码 DIE DIE LFQFP DIE LFQFP
封装形状 RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE
封装形式 UNCASED CHIP UNCASED CHIP FLATPACK, LOW PROFILE, FINE PITCH UNCASED CHIP FLATPACK, LOW PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ROM可编程性 FLASH FLASH FLASH FLASH FLASH
速度 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
标称供电电压 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER OTHER OTHER
端子形式 NO LEAD NO LEAD GULL WING NO LEAD GULL WING
端子位置 UPPER UPPER QUAD UPPER QUAD
宽度 3.33 mm 3.33 mm 20 mm 3.33 mm 20 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1 1 - -
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