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ML610Q431-XXXWA

描述：

RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136

分类：

嵌入式处理器和控制器微控制器和处理器

文件大小：

631KB，共35页

制造商：

LAPIS Semiconductor Co Ltd

标准：

Rohs认证

概述

RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136

器件参数

参数名称

属性值

是否Rohs认证

符合

零件包装代码

DIE

包装说明

CHIP-136

针数

136

Reach Compliance Code

unknown

具有ADC

YES

其他特性

OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ

地址总线宽度

位大小

8

最大时钟频率

4.096 MHz

DAC 通道

NO

DMA 通道

NO

外部数据总线宽度

JESD-30 代码

R-XUUC-N136

长度

4.23 mm

I/O 线路数量

31

端子数量

136

最高工作温度

70 °C

最低工作温度

-20 °C

PWM 通道

YES

封装主体材料

UNSPECIFIED

封装代码

DIE

封装形状

RECTANGULAR

封装形式

UNCASED CHIP

认证状态

Not Qualified

ROM可编程性

FLASH

速度

4.2 MHz

最大供电电压

3.6 V

最小供电电压

1.8 V

标称供电电压

3 V

表面贴装

YES

技术

CMOS

温度等级

OTHER

端子形式

NO LEAD

端子位置

UPPER

宽度

3.33 mm

uPs/uCs/外围集成电路类型

MICROCONTROLLER, RISC

Base Number Matches

1

文档解析

这份文档是关于LAPIS Semiconductor ML610Q431/ML610Q432系列8位微控制器的数据手册。以下是一些值得关注的技术信息：

微控制器概述：
- 8位RISC CPU (nX-U8/100)，支持1指令1时钟模式的高效指令执行。
- 内置LCD驱动器，支持点阵显示。
主要特性：
- 丰富的外设，包括实时时钟、同步串行端口、UART、I2C总线接口、旋律驱动器、电池电量检测电路、RC振荡型A/D转换器、12位逐次逼近型A/D转换器等。
- 内置调试功能，便于程序调试和编程。
- Flash ROM作为程序存储器，低电压低功耗运行。
内存：
- 内置64KB Flash ROM（包括1KB不可用的测试区域）。
- 2KB数据RAM，192Byte显示RAM，1024Byte显示分配RAM。
中断控制器：
- 2个不可屏蔽中断源，23个可屏蔽中断源。
定时器和计数器：
- 低高速时间基准计数器，看门狗定时器，8位定时器（4通道），1kHz定时器。
通信接口：
- UART，I2C总线接口（仅主机功能），同步串行端口。
A/D转换器：
- RC振荡型A/D转换器，24位计数器，2通道时间分割。
- 12位逐次逼近型A/D转换器，2通道输入。
LCD驱动：
- 支持多达1024或1536点的点阵显示，多种偏置和帧频率选择。
电源管理：
- HALT模式、STOP模式、时钟齿轮以及电源控制功能。
封装信息：
- 提供了详细的芯片布局和尺寸，以及封装类型（例如LQFP144）。
电气特性：
- 包括电源电压、输入/输出电压和电流、功耗等的绝对最大额定值和推荐工作条件。
应用电路和测量电路：
- 提供了振荡器、电源、LCD偏置等电路的示例和测量方法。
修订历史：
- 文档的修订记录，显示了从第一版到现在的变更。
版权和免责声明：
- 有关版权、使用限制和责任免除的法律声明。

文档预览

FEDL610Q431-02

Issue Date: Feb.8, 2011

ML610Q431/ML610Q432

8-bit Microcontroller with a Built-in LCD driver

GENERAL DESCRIPTION

This LSI is a high-performance 8-bit CMOS microcontroller into which rich peripheral circuits, such as real-time clock,

synchronous serial port, UART, I

2

C bus interface (master), melody driver, battery level detect circuit, RC oscillation type A/D

converter, 12-bit successive approximation type A/D converter, and LCD driver, are incorporated around 8-bit CPU nX-U8/100.

The CPU nX-U8/100 is capable of efficient instruction execution in 1-intruction 1-clock mode by 3-stage pipe line architecture

parallel procesing. The Flash ROM that is installed as program memory achieves low-voltage low-power consumption operation

(read operation) equivalent to mask ROM and is most suitable for battery-driven applications.

The on-chip debug function that is installed enables program debugging and programming.

FEATURES



CPU



8-bit RISC CPU (CPU name: nX-U8/100)



Instruction system: 16-bit instructions



Instruction set:

Transfer, arithmetic operations, comparison, logic operations, multiplication/division, bit

manipulations, bit logic operations, jump, conditional jump, call return stack manipulations, arithmetic

shift, and so on



On-Chip debug function



Minimum instruction execution time

30.5

s

(@32.768 kHz system clock)

0.24 4s (@4.096 MHz system clock)



Internal memory



Internal 64KBbyte Flash ROM (32K16 bits) (including unusable 1KByte TEST area)



Internal 2KByte Data RAM (20488 bits), 1KByte Display Allocation RAM (1024 x 8bit)



Internal 192Byte RAM for display



Interrupt controller



2 non-maskable interrupt sources (Internal source: 1, External source: 1)



23 maskable interrupt sources (Internal sources: 19, External sources: 4)



Time base counter



Low-speed time base counter

1

channel

Frequency compensation (Compensation range: Approx.

488ppm

to +488ppm. Compensation accuracy: Approx.

0.48ppm)



High-speed time base counter

1

channel



Watchdog timer



Non-maskable interrupt and reset



Free running



Overflow period: 4 types selectable (125ms, 500ms, 2s, and 8s)



Timers



8 bits



4 channels (16-bit configuration available)



1 kHz timer



10 Hz/1 Hz interrupt function

1/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432



Capture



Time base capture



2 channels (4096 Hz to 32 Hz)



PWM



Resolution 16 bits



1 channel



Real time clock



Year, month, day, day of the week, hour, minute, and second registers



Automatic leap year correction



Regular interrupts (0.5 sec, 1 sec, 1 minute, 1 hour)



Alarm interrupt



2 channels (day of the week, hour, minute; month, day hour, minute)



Synchronous serial port



Master/slave selectable



LSB first/MSB first selectable



8-bit length/16-bit length selectable



UART



TXD/RXD



1 channel



Bit length, parity/no parity, odd parity/even parity, 1 stop bit/2 stop bits



Positive logic/negative logic selectable



Built-in baud rate generator



I

2

C bus interface



Master function only



Fast mode (400 kbps@4MH½), standard mode (100 kbps@1MH½, 50kbps@500kHz)



Melody driver



Scale: 29 types (Melody sound frequency: 508 Hz to 32.768 kHz)



Tone length: 63 types



Tempo: 15 types



Buzzer output mode (4 output modes, 8 frequencies, 16 duty levels)



RC oscillation type A/D converter



24-bit counter



Time division



2 channels



Successive approximation type A/D converter



12-bit A/D converter



Input



2 channels



General-purpose ports



Non-maskable interrupt input port



1 channel



Input-only port



6 channels (including secondary functions)



Output-only port



3 channels (including secondary functions)



Input/output port

ML610Q431: 22 channels (including secondary functions)

ML610Q432: 14 channels (including secondary functions)

2/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432



LCD driver



Dot matrix can be supported.

ML610Q431: 1024 dots max. (64 seg



16 com)

ML610Q432: 1536 dots max. (64 seg



24 com)



1/1 to 1/24 duty



1/3 or 1/4 bias (built-in bias generation circuit)



Frame frequency selecable (approx. 64 Hz, 73 Hz, 85 Hz, and 102 Hz)



Bias voltage multiplying clock selectable (8 types)



Contrast adjustment (1/3 bias: 32 steps, 1/4 bias: 20 steps)



LCD drive stop mode, LCD display mode, all LCDs on mode, and all LCDs off mode selectable



Programmable display allocation function (available only when 1/1~1/8 duty is selected)



Reset



Reset through the RESET_N pin



Power-on reset generation when powered on



Reset when oscillation stop of the low-speed clock is detected



(“A”version(ML610Q431A/Q432A) don’t have the oscilation stop function.)



Reset by the watchdog timer (WDT) overflow



Power supply voltage detect function



Judgment voltages:

One of 16 levels



Judgment accuracy:

2%

(Typ.)



Clock



Low-speed clock: (This LSI can not guarantee the operation withoug low-speed clock)

Crystal oscillation (32.768 kHz)



High-speed clock:

Built-in RC oscillation (500 kHz)

Built-in PLL oscillation (8.192 MHz

2.5%),

crystal/ceramic oscillation (4.096 MHz), external clock



Selection of high-speed clock mode by software:

Built-in RC oscillation, built-in PLL oscillation, crystal/ceramic oscillation, external clock



Power management



HALT mode: Instruction execution by CPU is suspended (peripheral circuits are in operating states).



STOP mode: Stop of low-speed oscillation and high-speed oscillation (Operations of CPU and peripheral circuits are

stopped.)



Clock gear: The frequency of high-speed system clock can be changed by software (1/1, 1/2, 1/4, or 1/8 of the oscillation

clock)



Block Control Function: Power down (reset registers and stop clock supply) the circuits of unused peripherals.



Shipment



Chip

ML610Q431-xxxWA (Blank product: ML610Q431-NNNWA)

ML610Q432-xxxWA (Blank product: ML610Q432-NNNWA)

ML610Q431A-xxxWA (Blank product: ML610Q431A-NNNWA)

ML610Q432A-xxxWA (Blank product: ML610Q432A-NNNWA)



144-pin plastic LQFP

ML610Q431-xxxTCZ03A (Blank product: ML610Q431-NNNTCZ03A)

ML610Q432-xxxTCZ03A (Blank product: ML610Q432-NNNTCZ03A)

ML610Q431A-xxxTCZ03A (Blank product: ML610Q431A-NNNTCZ03A)

ML610Q432A-xxxTCZ03A (Blank product: ML610Q432A-NNNTCZ03A)

xxx: ROM code number



Guaranteed operating range



Operating temperature:

20C

to 70C



Operating voltage: V

DD

= 1.1V to 3.6V, AV

DD

= 2.2V to 3.6V

3/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432

BLOCK DIAGRAM

ML610Q431 Block Diagram

Figure 1 show the block diagram of the ML610Q431.

"*" indicates the secondary function of each port.

CPU (nX-U8/100)

EPSW1½3

PSW

Timing

Controller

GREG

0½15

ALU

Instruction

Decoder

ELR1½3

LR

EA

SP

Instruction

Register

Data-bus

RAM

2048byte

Interrupt

Controller

INT

1

INT

4

Power

INT

1

INT

1

INT

1

UART

INT

1

I

2

C

TBC

INT

1

PWM

1kHzTC

INT

1

INT

5

PWM0*

SDA*

SCL*

RXD0*

TXD0*

BUS

Controller

ECSR1½3

DSR/CSR

PC

Program

Memory

(Flash)

64Kbyte

V

PP

On-Chip

ICE

V

DD

V

SS

RESET_N

TEST

XT0

XT1

OSC0*

OSC1*

LSCLK*

OUTCLK*

V

DDL

V

DDX

OSC

RESET &

TEST

INT

1

SSIO

SCK0*

SIN0*

SOUT0*

WDT

IN0*

CS0*

RS0*

RT0*

RCT0*

RCM*

IN1*

CS1*

RS1*

RT1*

AV

DD

AV

SS

V

REF

AIN0, AIN1

RC-ADC

×2

Capture

×2

INT

4

INT

3

8bit Timer

×4

Melody

MD0*

NMI

P00 to P03

P10 to P11

GPIO

P20 to P22

P30 to P35

P40 to P47

PA0 to PA7

COM0 to COM15

SEG0 to SEG63

V

L1

, V

L2

, V

L3

, V

L4

C1, C2, C3, C4

INT

1

12bit-ADC

RTC

Display Allocation

RAM 1024Byte

Display RAM

192Byte

LCD

Driver

BLD

LCD

BIAS

Figure 1 ML610Q431 Block Diagram

4/35

FEDL610Q431-02

LAPIS Semiconductor

ML610Q431/ML610Q432

ML610Q432 Block Diagram

Figure 2 show the block diagram of the ML610Q432.

"*" indicates the secondary function of each port.

CPU (nX-U8/100)

EPSW1½3

PSW

Timing

Controller

GREG

0½15

ALU

Instruction

Decoder

ELR1½3

LR

EA

SP

Instruction

Register

Data-bus

RAM

2048byte

Interrupt

Controller

INT

1

INT

4

Power

INT

1

INT

1

INT

1

UART

INT

1

I

2

C

TBC

INT

1

PWM

1kHzTC

INT

1

INT

5

PWM0*

SDA*

SCL*

RXD0*

TXD0*

BUS

Controller

ECSR1½3

DSR/CSR

PC

Program

Memory

(Flash)

64Kbyte

V

PP

On-Chip

ICE

V

DD

V

SS

RESET_N

TEST

XT0

XT1

OSC0*

OSC1*

LSCLK*

OUTCLK*

V

DDL

V

DDX

OSC

RESET &

TEST

INT

1

SSIO

SCK0*

SIN0*

SOUT0*

WDT

IN0*

CS0*

RS0*

RT0*

RCT0*

RCM*

IN1*

CS1*

RS1*

RT1*

AV

DD

AV

SS

V

REF

AIN0, AIN1

RC-ADC

×2

Capture

×2

INT

4

INT

3

8bit Timer

×4

Melody

MD0*

NMI

P00 to P03

P10 to P11

GPIO

P20 to P22

P30 to P35

P40 to P47

INT

1

12bit-ADC

RTC

Display Allocation

RAM 1024Byte

Display RAM

192Byte

LCD

Driver

COM0 to COM23

SEG0 to SEG63

V

L1

, V

L2

, V

L3

, V

L4

C1, C2, C3, C4

BLD

LCD

BIAS

Figure 2 ML610Q432 Block Diagram

5/35

参数对比

与ML610Q431-XXXWA相近的元器件有：ML610Q432-XXXWA、ML610Q431-NNNTCZ03A、ML610Q432-NNNWA、ML610Q432-XXXTCZ03A。描述及对比如下：

型号	ML610Q431-XXXWA	ML610Q432-XXXWA	ML610Q431-NNNTCZ03A	ML610Q432-NNNWA	ML610Q432-XXXTCZ03A
描述	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, CHIP-136	RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
是否Rohs认证	符合	符合	符合	符合	符合
零件包装代码	DIE	DIE	QFP	DIE	QFP
包装说明	CHIP-136	CHIP-136	20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144	CHIP-136	20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
针数	136	136	144	136	144
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
具有ADC	YES	YES	YES	YES	YES
其他特性	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ	OPERATES AT 1.1 AND 1.3 V MINIMUM SUPPLY AT 36 KHZ AND 650 KHZ
位大小	8	8	8	8	8
最大时钟频率	4.096 MHz	4.096 MHz	4.096 MHz	4.096 MHz	4.096 MHz
DAC 通道	NO	NO	NO	NO	NO
DMA 通道	NO	NO	NO	NO	NO
JESD-30 代码	R-XUUC-N136	R-XUUC-N136	S-PQFP-G144	R-XUUC-N136	S-PQFP-G144
长度	4.23 mm	4.23 mm	20 mm	4.23 mm	20 mm
I/O 线路数量	31	23	31	23	23
端子数量	136	136	144	136	144
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C
最低工作温度	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
PWM 通道	YES	YES	YES	YES	YES
封装主体材料	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY
封装代码	DIE	DIE	LFQFP	DIE	LFQFP
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
封装形式	UNCASED CHIP	UNCASED CHIP	FLATPACK, LOW PROFILE, FINE PITCH	UNCASED CHIP	FLATPACK, LOW PROFILE, FINE PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH
速度	4.2 MHz	4.2 MHz	4.2 MHz	4.2 MHz	4.2 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
标称供电电压	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	NO LEAD	NO LEAD	GULL WING	NO LEAD	GULL WING
端子位置	UPPER	UPPER	QUAD	UPPER	QUAD
宽度	3.33 mm	3.33 mm	20 mm	3.33 mm	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	1	1	1	-	-

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