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SH8MA2GZETB

MOSFET - 阵列 N 和 P 沟道 30V 4.5A(Ta) 1.4W(Ta) 表面贴装型 8-SOP

产品类别:分立半导体    晶体管   

制造商:ROHM(罗姆半导体)

官网地址:https://www.rohm.com/

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SH8MA2GZETB概述
SH8MA2 是具有低接通电阻的功率 MOSFET,适用于开关应用。

- 低接通电阻
- 小型表面安装封装 (SOP8)
- 无铅引线电镀
- 无卤素
SH8MA2GZETB规格参数
参数名称
属性值
类别
分立半导体;晶体管
厂商名称
ROHM(罗姆半导体)
包装
卷带(TR)剪切带(CT)
技术
MOSFET(金属氧化物)
配置
N 和 P 沟道
漏源电压(Vdss)
30V
25°C 时电流 - 连续漏极 (Id)
4.5A(Ta)
不同 Id、Vgs 时导通电阻(最大值)
80mOhm @ 4.5A,10V,82mOhm @ 4.5A,10V
不同 Id 时 Vgs(th)(最大值)
2.5V @ 1mA
不同 Vgs 时栅极电荷 (Qg)(最大值)
3nC @ 4.5V,6.7nC @ 4.5V
不同 Vds 时输入电容 (Ciss)(最大值)
125pF @ 15V,305pF @ 15V
功率 - 最大值
1.4W(Ta)
工作温度
150°C(TJ)
安装类型
表面贴装型
封装/外壳
8-SOIC(0.154",3.90mm 宽)
供应商器件封装
8-SOP
基本产品编号
SH8MA2
SH8MA2GZETB文档预览
SH8MA2
  
30V Nch+Pch Power MOSFET
  
Datasheet
l
Outline
Symbol
V
DSS
R
DS(on)
(Max.)
I
D
P
D
Tr1:Nch Tr2:Pch
30V
80mΩ
±4.5A
-30V
82mΩ
±4.5A
SOP8
 
 
           
 
2.7W
l
Features
1) Low on - resistance
2) Small Surface Mount Package (SOP8)
3) Pb-free lead plating ; RoHS compliant
4) Halogen Free
l
Inner circuit
l
Packaging specifications
Packing
l
Application
Switching
Type
Reel size (mm)
Tape width (mm)
Basic ordering unit (pcs)
Taping code
Marking
Value
Tr1:Nch Tr2:Pch
30
-30
±4.5
±4.5
±12
±12
±20
±20
4.0
-4.0
1.1
1.4
2.7
2.0
1.4
150
-55 to +150
Embossed
Tape
330
12
2500
TB
SH8MA2
l
Absolute maximum ratings
(T
a
= 25°C ,unless otherwise specified)
Parameter
Drain - Source voltage
Continuous drain current
Pulsed drain current
Gate - Source voltage
Avalanche current, single pulse
Avalanche energy, single pulse
Power dissipation (total)
 
Symbol
V
DSS
I
D*1
I
DP*2
V
GSS
I
AS*3
E
AS*3
P
D*1
P
D*4
P
D*5
T
j
T
stg
1/19
Unit
V
A
A
V
A
mJ
W
Junction temperature
Operating junction and storage temperature range
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© 2017 ROHM Co., Ltd. All rights reserved.
                                                                                         
20170511 - Rev.001
   
SH8MA2
l
Thermal resistance
      
 
        
Datasheet
                                   
Parameter
Thermal resistance, junction - ambient (total)
Symbol
R
thJA*4
R
thJA*5
Values
Min.
-
-
Typ.
-
-
Max.
62.5
89.2
Unit
/W
l
Electrical characteristics (T
a
= 25°C)
Parameter
Drain - Source breakdown
voltage
Breakdown voltage
temperature coefficient
Zero gate voltage
drain current
Gate - Source
leakage current
Gate threshold
voltage
Gate threshold voltage
temperature coefficient
Symbol Type
V
(BR)DSS
Conditions
Values
Min.
30
-30
-
-
-
-
-
-
1.0
-1.0
-
-
-
-
-
-
-
-
1.7
2.0
Typ.
-
-
21
-22
-
-
-
-
-
-
-3
2.9
57
88
63
89
3.5
13
-
-
Max.
-
-
-
-
1
-1
±100
±100
2.5
-2.5
-
-
80
125
82
115
-
-
-
-
Unit
V
mV/
μA
nA
V
mV/
Tr1 V
GS
= 0V, I
D
= 1mA
Tr2 V
GS
= 0V, I
D
= -1mA
I
D
= 1mA, referenced to 25
I
D
= -1mA, referenced to 25
Δ
 
V
(BR)DSS
Tr1
 
 
ΔT
j
   
Tr2
 
I
DSS
I
GSS
V
GS(th)
Tr1 V
DS
= 30V, V
GS
= 0V
Tr2 V
DS
= -30V, V
GS
= 0V
Tr1 V
DS
= 0V, V
GS
= ±20V
Tr2 V
DS
= 0V, V
GS
= ±20V
Tr1 V
DS
= V
GS
, I
D
= 1mA
Tr2 V
DS
= V
GS
, I
D
= -1mA
I
D
= 1mA, referenced to 25
I
D
= -1mA, referenced to 25
Δ
 
V
GS(th)
 
Tr1
  ΔT
j
   
Tr2
 
Tr1
Static drain - source
on - state resistance
R
DS(on)*6
Tr2
Gate resistance
Forward Transfer
Admittance
R
G
|Y
fs
|
*6
Tr1
Tr2
V
GS
= 10V, I
D
= 4.5A
V
GS
= 4.5V, I
D
= 4.0A
V
GS
= -10V, I
D
= -4.5A
V
GS
= -4.5V, I
D
= -4.0A
f=1MHz, open drain
Ω
S
Tr1 V
DS
= 5.0V, I
D
= 4.0A
Tr2 V
DS
= -5.0V, I
D
= -4.0A
*1 Pw
1s, Mounted on a ceramic board (30×30×0.8mm), Limited only by maximum temperature allowed.
*2 Pw
10μs, Duty cycle
1%
*3 Tr1:L
0.1mH, V
DD
= 15V, R
G
= 25Ω, Starting T
j
= 25
Fig.1-1,1-2
Tr2: L
0.1mH, V
DD
= -15V, R
G
= 25Ω, Starting T
j
= 25
Fig.3-1,3-2
*4 Mounted on a ceramic board (30×30×0.8mm)
*5 Mounted on a FR4 (25×25×0.8mm)
*6 Pulsed
                                                 
 
                                          
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© 2017 ROHM Co., Ltd. All rights reserved.
2/19
20170511 - Rev.001
SH8MA2
      
 
        
Datasheet
l
Electrical characteristics
(T
a
= 25°C)
<Tr1>
Parameter
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn - on delay time
Rise time
Turn - off delay time
Fall time
<Tr2>
Parameter
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn - on delay time
Rise time
Turn - off delay time
Fall time
Symbol
C
iss
C
oss
C
rss
t
d(on)*5
t
r*5
t
d(off)*5
t
f*5
Conditions
Min.
V
GS
= 0V
V
DS
= 15V
f = 1MHz
V
DD
15V, V
GS
= 10V
Values
Typ.
125
20
15
5.0
7.5
10
3.5
Max.
-
-
-
-
-
Unit
-
-
-
-
-
-
-
pF
I
D
= 2.25A
R
L
= 6.67Ω
R
G
= 10Ω
ns
-
-
Symbol
C
iss
C
oss
C
rss
t
d(on)*5
t
r*5
t
d(off)*5
t
f*5
Conditions
Min.
V
GS
= 0V
V
DS
= -15V
f = 1MHz
V
DD
-15V, V
GS
= -10V
Values
Typ.
305
55
43
7.2
8.0
28.0
8.5
Max.
-
-
-
-
-
Unit
-
-
-
-
-
-
-
pF
I
D
= -2.25A
R
L
= 6.67Ω
R
G
= 10Ω
ns
-
-
                                                 
 
                                          
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
3/19
20170511 - Rev.001
SH8MA2
      
 
        
Datasheet
l
Gate charge characteristics
(T
a
= 25°C)
<Tr1>
Parameter
Symbol
Q
g*6
Q
gs*6
Q
gd*6
V
DD
15V
I
D
= 4.5A
Conditions
V
GS
= 10V
Values
Min.
-
-
Typ.
3.0
1.5
0.6
0.5
Values
Min.
-
-
-
-
Typ.
6.7
3.4
1.1
1.3
Max.
-
-
Max.
-
-
Unit
Total gate charge
Gate - Source charge
Gate - Drain charge
<Tr2>
Parameter
nC
V
GS
= 4.5V
-
-
-
-
Symbol
Q
g*6
Q
gs
*6
Conditions
V
GS
= -10V
Unit
Total gate charge
Gate - Source charge
Gate - Drain charge
V
DD
-15V
I
D
= -4.5A
V
GS
= -4.5V
nC
-
-
Q
gd*6
l
Body diode electrical characteristics
(Source-Drain) (T
a
= 25°C)
<Tr1>
Parameter
Continuous forward current
Pulse forward current
Forward voltage
<Tr2>
Parameter
Continuous forward current
Pulse forward current
Forward voltage
Symbol
I
S
I
SP*2
V
SD*6
Conditions
T
a
= 25
V
GS
= 0V, I
S
= -1.67A
Values
Min.
-
-
-
Typ.
-
-
-
Max.
-1.67
A
-12
-1.2
V
Unit
Symbol
I
S
I
SP*2
V
SD*6
Conditions
T
a
= 25
V
GS
= 0V, I
S
= 1.67A
Values
Min.
-
-
-
Typ.
-
-
-
Max.
1.67
A
12
1.2
V
Unit
                                                 
 
                                          
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
4/19
20170511 - Rev.001
SH8MA2
      
        
Datasheet
l
Electrical characteristic curves <Tr1>
Fig.1 Power Dissipation Derating Curve
Fig.2 Maximum Safe Operating Area
Fig.3 Normalized Transient Thermal
    
Resistance vs. Pulse Width
Fig.4 Single Pulse Maximum Power
    
dissipation
                                                                                           
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
5/19
20170511 - Rev.001
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