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SIHH080N60E-T1-GE3

N沟道增强型MOS管, E Series系列, Vds=650 V, 32 A, PowerPAK 8 x 8封装, 表面贴装

产品类别:分立半导体    晶体管   

制造商:Vishay(威世)

官网地址:http://www.vishay.com

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SIHH080N60E-T1-GE3概述
Vishay E 系列功率 MOSFET 可减少开关和传导损耗。

低品质因数 (FOM) Ron x Qg
低有效电容 (Co (er))
SIHH080N60E-T1-GE3规格参数
参数名称
属性值
类别
分立半导体;晶体管
厂商名称
Vishay(威世)
系列
E
包装
卷带(TR)剪切带(CT)
FET 类型
N 通道
技术
MOSFET(金属氧化物)
漏源电压(Vdss)
600 V
25°C 时电流 - 连续漏极 (Id)
32A(Tc)
驱动电压(最大 Rds On,最小 Rds On)
10V
不同 Id、Vgs 时导通电阻(最大值)
80 毫欧 @ 17A,10V
不同 Id 时 Vgs(th)(最大值)
5V @ 250µA
不同 Vgs 时栅极电荷 (Qg)(最大值)
63 nC @ 10 V
Vgs(最大值)
±30V
不同 Vds 时输入电容 (Ciss)(最大值)
2557 pF @ 100 V
功率耗散(最大值)
184W(Tc)
工作温度
-55°C ~ 150°C(TJ)
安装类型
表面贴装型
供应商器件封装
PowerPAK® 8 x 8
封装/外壳
8-PowerTDFN
SIHH080N60E-T1-GE3文档预览
SiHH080N60E
www.vishay.com
Vishay Siliconix
E Series Power MOSFET
D
FEATURES
• 4
th
generation E series technology
• Low figure-of-merit (FOM) R
on
x Q
g
• Low effective capacitance (C
o(er)
)
PowerPAK
®
8 x 8
4
1
2
3
3
G
• Reduced switching and conduction losses
• Avalanche energy rated (UIS)
S
N-Channel MOSFET
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
APPLICATIONS
• Server and telecom power supplies
• Switch mode power supplies (SMPS)
PRODUCT SUMMARY
V
DS
(V) at T
J
max.
R
DS(on)
typ. (Ω) at 25 °C
Q
g
max. (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
63
19
10
Single
650
0.070
• Power factor correction power supplies (PFC)
• Lighting
- High-intensity discharge (HID)
- Fluorescent ballast lighting
• Industrial
- Welding
- Induction heating
- Motor drives
- Battery chargers
- Solar (PV inverters)
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 8 x 8
SIHH080N60E-T1-GE3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
Continuous drain current (T
J
= 150 °C)
Pulsed drain current
a
Linear derating factor
Single pulse avalanche
energy
b
E
AS
P
D
T
J
, T
stg
T
J
= 125 °C
dv/dt
Maximum power dissipation
Operating junction and storage temperature range
Drain-source voltage slope
Reverse diode dv/dt
d
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature
b. V
DD
= 120 V, starting T
J
= 25 °C, L = 28.2 mH, R
g
= 25
Ω,
I
AS
= 4.0 A
c. 1.6 mm from case
d. I
SD
I
D
, di/dt = 100 A/μs, starting T
J
= 25 °C
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
600
± 30
32
20
96
1.47
226
184
-55 to +150
100
10
W/°C
mJ
W
°C
V/ns
A
UNIT
V
S21-0062-Rev. A, 01-Feb-2021
Document Number: 92379
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHH080N60E
www.vishay.com
Vishay Siliconix
SYMBOL
R
thJA
R
thJC
TYP.
39
0.51
MAX.
51
0.68
UNIT
°C/W
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient
Maximum junction-to-case (drain)
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-source breakdown voltage
V
DS
temperature coefficient
Gate-source threshold voltage (N)
Gate-source leakage
Zero gate voltage drain current
Drain-source on-state resistance
Forward transconductance
Dynamic
Input capacitance
Output capacitance
Reverse transfer capacitance
Effective output capacitance, energy
related
a
Effective output capacitance, time
related
b
Total gate charge
Gate-source charge
Gate-drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate input resistance
Drain-Source Body Diode Characteristics
Continuous source-drain diode current
Pulsed diode forward current
Diode forward voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
I
S
I
SM
V
SD
t
rr
Q
rr
I
RRM
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
V
DS
ΔV
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
C
o(er)
TEST CONDITIONS
V
GS
= 0 V, I
D
= 250 μA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 μA
V
GS
= ± 20 V
V
GS
= ± 30 V
V
DS
= 600 V, V
GS
= 0 V
V
DS
= 480 V, V
GS
= 0 V, T
J
= 125 °C
V
GS
= 10 V
I
D
= 17 A
V
DS
= 20 V, I
D
= 17 A
MIN.
600
-
3.0
-
-
-
-
-
-
-
-
-
-
TYP.
-
0.64
-
-
-
-
-
0.070
4.6
2557
105
6
79
499
42
19
10
31
96
37
31
0.7
MAX.
-
-
5.0
± 100
±1
1
10
0.080
-
-
-
-
UNIT
V
V/°C
V
nA
μA
μA
Ω
S
a
V
GS
= 0 V,
V
DS
= 100 V,
f = 1 MHz
pF
-
-
63
-
-
62
144
74
62
1.4
Ω
ns
nC
V
DS
= 0 V to 480 V, V
GS
= 0 V
C
o(tr)
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
g
f = 1 MHz
V
DD
= 480 V, I
D
= 17 A,
V
GS
= 10 V, R
g
= 9.1
Ω
V
GS
= 10 V
I
D
= 17 A, V
DS
= 480 V
-
-
-
-
-
-
-
-
0.3
-
-
-
-
-
-
-
-
-
441
5.2
21
35
A
96
1.2
882
10.4
-
V
ns
μC
A
G
S
T
J
= 25 °C, I
S
= 17 A, V
GS
= 0 V
T
J
= 25 °C, I
F
= I
S
= 17 A,
di/dt = 80 A/μs, V
R
= 25 V
Notes
a. C
oss(er)
is a fixed capacitance that gives the same energy as C
oss
while V
DS
is rising from 0 % to 80 % V
DSS
b. C
oss(tr)
is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 % to 80 % V
DSS
S21-0062-Rev. A, 01-Feb-2021
Document Number: 92379
2
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHH080N60E
www.vishay.com
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Axis Title
100
2nd line
I
D
- Drain-to-Source Current (A)
15 V
14 V
13 V
12 V
11 V
10 V
9V
Vishay Siliconix
Axis Title
10000
R
DS(on)
- Drain-to-Source On-Resistance
(Normalized)
3.0
I
D
=17 A
10000
2.5
2.0
1.5
V
GS
= 10 V
75
1000
1st line
2nd line
8V
1000
1st line
2nd line
100
10
-60 -40 -20 0
20 40 60 80 100 120 140 160
T
J
- Junction Temperature (°C)
10000
1000
1st line
2nd line
100
C
rss
V
GS
= 0 V, f = 1 MHz
C
iss
= C
gs
+ C
gd
, C
ds
shorted
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
50
T
J
= 25 °C
25
7V
100
1.0
0.5
0
0
0
5
10
15
V
DS
- Drain-to-Source Voltage (V)
6V
5V
10
20
Fig. 1 - Typical Output Characteristics
Axis Title
80
T
J
= 150 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
Axis Title
10000
100 000
10 000
2nd line
I
D
- Drain-to-Source Current (A)
8V
7V
1000
1st line
2nd line
2nd line
C - Capacitance (pF)
60
15 V
14 V
13 V
12 V
11 V
10 V
1000
100
10
1
0.1
C
oss
C
iss
40
100
20
6V
5V
0
0
5
10
15
20
V
DS
- Drain-to-Source Voltage (V)
10
0.01
0
100
200
300
400
500
600
V
DS
- Drain-to-Source Voltage (V)
10
Fig. 2 - Typical Output Characteristics
Axis Title
120
2nd line
I
D
- Drain-to-Source Current (A)
T
J
= 25 °C
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Axis Title
10000
50 000
2nd line
C
oss
- Output Capacitance (pF)
15
5000
C
oss
E
oss
90
1000
1st line
2nd line
60
10
T
J
= 150 °C
100
30
V
DS
= 25.6 V
500
5
50
10
0
100
200
300
400
500
600
20
V
DS
- Drain-to-Source Voltage (V)
0
0
0
5
10
15
V
GS
- Gate-to-Source Voltage (V)
Fig. 3 - Typical Transfer Characteristics
Fig. 6 - C
oss
and E
oss
vs. V
DS
S21-0062-Rev. A, 01-Feb-2021
Document Number: 92379
3
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
E
oss
- Output Capacitance Stored Energy (µJ)
2nd line
20
SiHH080N60E
www.vishay.com
Vishay Siliconix
Axis Title
10000
35
30
2nd line
I
D
- Drain Current (A)
25
20
15
10
5
100
10000
Axis Title
12
2nd line
V
GS
- Gate-to-Source Voltage (V)
V
DS
= 480 V
V
DS
= 300 V
V
DS
= 120 V
9
1000
6
100
3
1st line
2nd line
1000
1st line
2nd line
10
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Axis Title
0
0
12
24
36
48
Q
g
- Total Gate Charge (nC)
10
0
Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage
Axis Title
100
2nd line
I
SD
- Reverse Drain Current (A)
Fig. 10 - Maximum Drain Current vs. Case Temperature
2nd line
V
DS
- Drain-to-Source Breakdown Voltage
(Normalized)
10000
1.2
10000
1.1
T
J
= 150 °C
1000
1st line
2nd line
10
1000
1
T
J
= 25 °C
1
100
0.9
100
I
D
= 250uA
V
GS
= 0 V
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
V
SD
- Source-Drain Voltage (V)
10
0.8
-60 -40 -20
0
20 40 60
80 100 120 140 160
T
J
- Junction Temperature (
°C)
10
Fig. 8 - Typical Source-Drain Diode Forward Voltage
Axis Title
1000
Operation in this area
limited by R
DS(on)
I
DM
limited
Fig. 11 - Temperature vs. Drain-to-Source Voltage
10000
100
2nd line
I
D
- Drain Current (A)
1000
1st line
2nd line
10
Limited by R
DS(on) a
100 µs
1
1 ms
100
0.1
T
C
= 25 °C,
T
J
= 150 °C,
single pulse
10 ms
0.01
1
10
100
BVDSS limited
10
1000
V
DS
- Drain-to-Source Voltage (V)
Fig. 9 - Maximum Safe Operating Area
Note
a. V
GS
> minimum V
GS
at which R
DS(on)
is specified
S21-0062-Rev. A, 01-Feb-2021
Document Number: 92379
4
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
1st line
2nd line
SiHH080N60E
www.vishay.com
Vishay Siliconix
Axis Title
1
Duty cycle = 0.5
10000
Normalized Effective Transient
Thermal Impedance
0.2
0.1
1000
1st line
2nd line
100
Single pulse
0.1
0.05
0.02
0.01
0.000001
10
0.00001
0.0001
0.001
Pulse Time (s)
0.01
0.1
1
Fig. 12 - Normalized Transient Thermal Impedance, Junction-to-Case
Axis Title
1
Duty cycle = 0.5
0.2
10000
R
thJA
- Normalized Thermal
Transient Impedance
0.1
0.1
0.05
0.02
1000
1st line
2nd line
Single pulse
0.01
100
0.001
0.0001
0.0001
0.001
0.01
0.1
Pulse Time (s)
1
10
100
10
1000
Fig. 13 - Normalized Transient Thermal Impedance, Junction-to-Ambient
V
DS
V
GS
R
g
R
D
V
DS
D.U.T.
+
-
V
DD
90 %
10 V
Pulse width ≤ 1 μs
Duty factor ≤ 0.1 %
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig. 14 - Switching Time Test Circuit
Fig. 15 - Switching Time Waveforms
S21-0062-Rev. A, 01-Feb-2021
Document Number: 92379
5
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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