型号 | IBM11M2645H-60 | IBM11M2645L-60J | IBM11M2645HB-70 | IBM11M2645HB-60T | IBM11M2645H-60T | IBM11M2645H-70 | IBM11M2645H-70T | IBM11M2645HB-70T | IBM11M2645HB-60 | IBM11M2645L-70J |
---|---|---|---|---|---|---|---|---|---|---|
描述 | EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA168 | EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA168 | EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA168 | EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA168 | EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168 |
包装说明 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 60 ns | 60 ns | 70 ns | 60 ns | 60 ns | 70 ns | 70 ns | 70 ns | 60 ns | 70 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDMA-N168 | R-XDMA-N168 | R-PDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-PDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-PDMA-N168 | R-XDMA-N168 |
内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
内存集成电路类型 | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
端子数量 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 5 V | 5 V | 3.3 V | 3.3 V | 5 V | 5 V | 5 V | 3.3 V | 3.3 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 2048 | 1024 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 1024 |
座面最大高度 | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm |
自我刷新 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
最大压摆率 | 0.72 mA | 0.664 mA | 0.64 mA | 0.72 mA | 0.72 mA | 0.64 mA | 0.64 mA | 0.64 mA | 0.72 mA | 0.564 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 3.3 V | 3.3 V | 5 V | 5 V | 5 V | 3.3 V | 3.3 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | IBM | - | IBM | IBM | IBM | IBM | IBM | IBM | IBM | IBM |
零件包装代码 | - | DIMM | - | DIMM | DIMM | - | DIMM | DIMM | - | DIMM |
针数 | - | 168 | - | 168 | 168 | - | 168 | 168 | - | 168 |
ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | - | EAR99 |
访问模式 | - | FAST PAGE WITH EDO | - | FAST PAGE WITH EDO | FAST PAGE WITH EDO | - | FAST PAGE WITH EDO | FAST PAGE WITH EDO | - | FAST PAGE WITH EDO |
其他特性 | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
备用内存宽度 | - | 32 | - | 32 | 32 | - | 32 | 32 | - | 32 |
功能数量 | - | 1 | - | 1 | 1 | - | 1 | 1 | - | 1 |
端口数量 | - | 1 | - | 1 | 1 | - | 1 | 1 | - | 1 |
工作模式 | - | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
最大供电电压 (Vsup) | - | 5.5 V | - | 3.6 V | 5.5 V | - | 5.5 V | 3.6 V | - | 5.5 V |
最小供电电压 (Vsup) | - | 4.5 V | - | 3 V | 4.5 V | - | 4.5 V | 3 V | - | 4.5 V |