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IBM11M2645HB-60

EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA168

器件类别:存储    存储   

厂商名称:IBM

厂商官网:http://www.ibm.com

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器件参数
参数名称
属性值
厂商名称
IBM
包装说明
DIMM, DIMM168
Reach Compliance Code
unknown
最长访问时间
60 ns
I/O 类型
COMMON
JESD-30 代码
R-PDMA-N168
内存密度
134217728 bit
内存集成电路类型
EDO DRAM MODULE
内存宽度
64
端子数量
168
字数
2097152 words
字数代码
2000000
最高工作温度
70 °C
最低工作温度
组织
2MX64
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
DIMM
封装等效代码
DIMM168
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
电源
3.3 V
认证状态
Not Qualified
刷新周期
2048
座面最大高度
25.4 mm
自我刷新
NO
最大待机电流
0.008 A
最大压摆率
0.72 mA
标称供电电压 (Vsup)
3.3 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
DUAL
参数对比
与IBM11M2645HB-60相近的元器件有:IBM11M2645L-60J、IBM11M2645HB-70、IBM11M2645HB-60T、IBM11M2645H-60、IBM11M2645H-60T、IBM11M2645H-70、IBM11M2645H-70T、IBM11M2645HB-70T、IBM11M2645L-70J。描述及对比如下:
型号 IBM11M2645HB-60 IBM11M2645L-60J IBM11M2645HB-70 IBM11M2645HB-60T IBM11M2645H-60 IBM11M2645H-60T IBM11M2645H-70 IBM11M2645H-70T IBM11M2645HB-70T IBM11M2645L-70J
描述 EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA168 EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA168 EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA168 EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA168 EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168 EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168 EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168
包装说明 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
最长访问时间 60 ns 60 ns 70 ns 60 ns 60 ns 60 ns 70 ns 70 ns 70 ns 70 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PDMA-N168 R-XDMA-N168 R-PDMA-N168 R-XDMA-N168 R-PDMA-N168 R-XDMA-N168 R-PDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
内存密度 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit
内存集成电路类型 EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE
内存宽度 64 64 64 64 64 64 64 64 64 64
端子数量 168 168 168 168 168 168 168 168 168 168
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 2MX64 2MX64 2MX64 2MX64 2MX64 2MX64 2MX64 2MX64 2MX64 2MX64
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
封装等效代码 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168 DIMM168
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
电源 3.3 V 5 V 3.3 V 3.3 V 5 V 5 V 5 V 5 V 3.3 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 2048 1024 2048 2048 2048 2048 2048 2048 2048 1024
座面最大高度 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm
自我刷新 NO NO NO NO NO NO NO NO NO NO
最大待机电流 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
最大压摆率 0.72 mA 0.664 mA 0.64 mA 0.72 mA 0.72 mA 0.72 mA 0.64 mA 0.64 mA 0.64 mA 0.564 mA
标称供电电压 (Vsup) 3.3 V 5 V 3.3 V 3.3 V 5 V 5 V 5 V 5 V 3.3 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
厂商名称 IBM - IBM IBM IBM IBM IBM IBM IBM IBM
零件包装代码 - DIMM - DIMM - DIMM - DIMM DIMM DIMM
针数 - 168 - 168 - 168 - 168 168 168
ECCN代码 - EAR99 - EAR99 - EAR99 - EAR99 EAR99 EAR99
访问模式 - FAST PAGE WITH EDO - FAST PAGE WITH EDO - FAST PAGE WITH EDO - FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
其他特性 - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH - RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
备用内存宽度 - 32 - 32 - 32 - 32 32 32
功能数量 - 1 - 1 - 1 - 1 1 1
端口数量 - 1 - 1 - 1 - 1 1 1
工作模式 - ASYNCHRONOUS - ASYNCHRONOUS - ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最大供电电压 (Vsup) - 5.5 V - 3.6 V - 5.5 V - 5.5 V 3.6 V 5.5 V
最小供电电压 (Vsup) - 4.5 V - 3 V - 4.5 V - 4.5 V 3 V 4.5 V
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器件捷径:
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