IBM11M2645H-60T,IBM11M2645H-60T pdf中文资料,IBM11M2645H-60T引脚图,IBM11M2645H-60T电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

厂商名称

IBM

零件包装代码

DIMM

包装说明

DIMM, DIMM168

针数

168

Reach Compliance Code

unknown

ECCN代码

EAR99

访问模式

FAST PAGE WITH EDO

最长访问时间

60 ns

其他特性

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

备用内存宽度

I/O 类型

COMMON

JESD-30 代码

R-XDMA-N168

内存密度

134217728 bit

内存集成电路类型

EDO DRAM MODULE

内存宽度

功能数量

端口数量

端子数量

168

字数

2097152 words

字数代码

2000000

工作模式

ASYNCHRONOUS

最高工作温度

70 °C

最低工作温度

组织

2MX64

输出特性

3-STATE

封装主体材料

UNSPECIFIED

封装代码

DIMM

封装等效代码

DIMM168

封装形状

RECTANGULAR

封装形式

MICROELECTRONIC ASSEMBLY

电源

5 V

认证状态

Not Qualified

刷新周期

2048

座面最大高度

25.4 mm

自我刷新

最大待机电流

0.008 A

最大压摆率

0.72 mA

最大供电电压 (Vsup)

5.5 V

最小供电电压 (Vsup)

4.5 V

标称供电电压 (Vsup)

5 V

表面贴装

技术

CMOS

温度等级

COMMERCIAL

端子形式

NO LEAD

端子节距

1.27 mm

端子位置

DUAL

参数对比

与IBM11M2645H-60T相近的元器件有：IBM11M2645L-60J、IBM11M2645HB-70、IBM11M2645HB-60T、IBM11M2645H-60、IBM11M2645H-70、IBM11M2645H-70T、IBM11M2645HB-70T、IBM11M2645HB-60、IBM11M2645L-70J。描述及对比如下：

型号	IBM11M2645H-60T	IBM11M2645L-60J	IBM11M2645HB-70	IBM11M2645HB-60T	IBM11M2645H-60	IBM11M2645H-70	IBM11M2645H-70T	IBM11M2645HB-70T	IBM11M2645HB-60	IBM11M2645L-70J
描述	EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168	EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168	EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA168	EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168	EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA168	EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA168	EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168	EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168	EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA168	EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168
包装说明	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	60 ns	60 ns	70 ns	60 ns	60 ns	70 ns	70 ns	70 ns	60 ns	70 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-XDMA-N168	R-XDMA-N168	R-PDMA-N168	R-XDMA-N168	R-PDMA-N168	R-PDMA-N168	R-XDMA-N168	R-XDMA-N168	R-PDMA-N168	R-XDMA-N168
内存密度	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit
内存集成电路类型	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
内存宽度	64	64	64	64	64	64	64	64	64	64
端子数量	168	168	168	168	168	168	168	168	168	168
字数	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
字数代码	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED
封装代码	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
封装等效代码	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
电源	5 V	5 V	3.3 V	3.3 V	5 V	5 V	5 V	3.3 V	3.3 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	2048	1024	2048	2048	2048	2048	2048	2048	2048	1024
座面最大高度	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm
自我刷新	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
最大待机电流	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
最大压摆率	0.72 mA	0.664 mA	0.64 mA	0.72 mA	0.72 mA	0.64 mA	0.64 mA	0.64 mA	0.72 mA	0.564 mA
标称供电电压 (Vsup)	5 V	5 V	3.3 V	3.3 V	5 V	5 V	5 V	3.3 V	3.3 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
厂商名称	IBM	-	IBM	IBM	IBM	IBM	IBM	IBM	IBM	IBM
零件包装代码	DIMM	DIMM	-	DIMM	-	-	DIMM	DIMM	-	DIMM
针数	168	168	-	168	-	-	168	168	-	168
ECCN代码	EAR99	EAR99	-	EAR99	-	-	EAR99	EAR99	-	EAR99
访问模式	FAST PAGE WITH EDO	FAST PAGE WITH EDO	-	FAST PAGE WITH EDO	-	-	FAST PAGE WITH EDO	FAST PAGE WITH EDO	-	FAST PAGE WITH EDO
其他特性	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-	-	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
备用内存宽度	32	32	-	32	-	-	32	32	-	32
功能数量	1	1	-	1	-	-	1	1	-	1
端口数量	1	1	-	1	-	-	1	1	-	1
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	-	-	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
最大供电电压 (Vsup)	5.5 V	5.5 V	-	3.6 V	-	-	5.5 V	3.6 V	-	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	-	3 V	-	-	4.5 V	3 V	-	4.5 V