课时1：Teaser

课时2：Successful MEMS products：accelerometer

课时3：Successful MEMS products：microphone

课时4：Successful MEMS products：BAW

课时5：Case study：thermomechanical microactuator

课时6：Cleanroom basics：introducing the issue of contamination

课时7：Cleanroom basics：cleanroom strategy

课时8：Basic principles of CVD and CVD reactors

课时9：CVD techniques at different operating pressure plasmaenhanced CVD and me

课时10：Atomic layer CVD ALD and thermal oxidation of silicon

课时11：Theoretical concepts of gas flow in CVD reactors

课时12：CVD thin film growth model

课时13：Specific CVD processes for siliconbased materials and diamond

课时14：Thermal oxidation processes of silicon and ALD deposition of specific oxid

课时15：Thermal evaporation：introduction and vapor creation

课时16：Thermal evaporation：film formation and examples

课时17：Thermal evaporation in CMi

课时18：Sputtering：introduction and plasma formation

课时19：Sputtering：spatial zones and Paschen law

课时20：Sputtering：DC RF magnetron

课时21：Sputtering：ion target interactions

课时22：Sputtering：film growth and control parameters

课时23：Sputtering：examples

课时24：Sputtering in CMi

课时25：SUPPLEMENTARY Other PVD methods

课时26：Film growth：atoms arrival and adhesion

课时27：Film growth：stress in thin films

课时28：SUPPLEMENTARY Film growth：growth modes and crystal structure

课时29：Introduction to lithography

课时30：Resist properties and exposure methods

课时31：SUPPLEMENTARY Photoresist sensitivity and modulation transfer function

课时32：UV lithography：direct writing and mask writing

课时33：UV lithography in CMi：mask fabrication

课时34：UV lithography：mask based lithography

课时35：UV lithography in CMi：mask based lithography

课时36：Electron beam lithography：tool overview

课时37：Electron beam lithography：electron optics and beam deflection

课时38：SUPPLEMENTARY Electron beam lithography：tool overview II

课时39：SUPPLEMENTARY Electron beam lithography：design preparation and fracture

课时40：Electron beam lithography：electronsample interactions

课时41：Electron beam lithography：resists

课时42：SUPPLEMENTARY Electron beam lithography：proximity effect

课时43：Alternative patterning methods：scanning probe lithography

课时44：SUPPLEMENTARY Alternative patterning methods：replication methods

课时45：Dry etching in a gas plasma：etching anisotropy

课时46：Deep dry etching of silicon dry etching without a plasma

课时47：Theoretical concepts of plasma generation

课时48：Types of dry etching equipment and plasma sources

课时49：Ion beam etching

课时50：Examples of etching processes for Sibased materials

课时51：Examples of etching processes for organic films and metals

课时52：Anisotropic and isotropic wet etching of Si and applications

课时53：HF bath for SiO2 and glass wet etching

课时54：Isotropic wet etching of silicon in the HNA bath

课时55：Anisotropic wet etching of silicon in alkaline baths

课时56：Etch stop techniques for thin membrane microfabrication and bulk micromach

课时57：Supercritical drying for realization of suspended structures test microst

课时58：Optical microscopy：inspection and dimension measurement

课时59：Optical thin film thickness measurement

课时60：Optical surface profile measurement

课时61：Mechanical surface profile measurement

课时62：Scanning electron microscopy

课时63：Focused ion beam：local cross sectional inspection and measurement

课时64：Electrical characterization